ball grid array

Mallik, Sabuj and Mehdawi, Ahmed Z. El (2014) Shear strength and fracture surface studies of ball grid array (BGA) flexible surface-mount electronics packaging under isothermal ageing. In: Yang, Gi-Chul, Ao, Sio-Iong and Gelman, Len, (eds.) Transactions on Engineering Technologies. Special Volume of the World Congress on Engineering 2013. Springer Netherlands, pp. 31-41. ISBN 9789401788311 (doi:https://doi.org/10.1007/978-94-017-8832-8_3)

ductile and brittle fractures

Mallik, Sabuj and Mehdawi, Ahmed Z. El (2014) Shear strength and fracture surface studies of ball grid array (BGA) flexible surface-mount electronics packaging under isothermal ageing. In: Yang, Gi-Chul, Ao, Sio-Iong and Gelman, Len, (eds.) Transactions on Engineering Technologies. Special Volume of the World Congress on Engineering 2013. Springer Netherlands, pp. 31-41. ISBN 9789401788311 (doi:https://doi.org/10.1007/978-94-017-8832-8_3)

Fractures

Mallik, Sabuj and Kaiser, Franziska (2014) Reliability study of subsea electronic systems subjected to accelerated thermal cycle ageing. In: Proceedings of The World Congress on Engineering 2014. Newswood Limited, Hong Kong, pp. 1436-1440. ISBN 978-988-19253-5-0 ISSN 2078-0958 (Print), 2078-0966 (Online)

isothermal ageing

Mallik, Sabuj and Mehdawi, Ahmed Z. El (2014) Shear strength and fracture surface studies of ball grid array (BGA) flexible surface-mount electronics packaging under isothermal ageing. In: Yang, Gi-Chul, Ao, Sio-Iong and Gelman, Len, (eds.) Transactions on Engineering Technologies. Special Volume of the World Congress on Engineering 2013. Springer Netherlands, pp. 31-41. ISBN 9789401788311 (doi:https://doi.org/10.1007/978-94-017-8832-8_3)

lead free solder alloy

Mallik, Sabuj and Mehdawi, Ahmed Z. El (2014) Shear strength and fracture surface studies of ball grid array (BGA) flexible surface-mount electronics packaging under isothermal ageing. In: Yang, Gi-Chul, Ao, Sio-Iong and Gelman, Len, (eds.) Transactions on Engineering Technologies. Special Volume of the World Congress on Engineering 2013. Springer Netherlands, pp. 31-41. ISBN 9789401788311 (doi:https://doi.org/10.1007/978-94-017-8832-8_3)

Reliability

Mallik, Sabuj and Kaiser, Franziska (2014) Reliability study of subsea electronic systems subjected to accelerated thermal cycle ageing. In: Proceedings of The World Congress on Engineering 2014. Newswood Limited, Hong Kong, pp. 1436-1440. ISBN 978-988-19253-5-0 ISSN 2078-0958 (Print), 2078-0966 (Online)

Shear strength

Mallik, Sabuj and Kaiser, Franziska (2014) Reliability study of subsea electronic systems subjected to accelerated thermal cycle ageing. In: Proceedings of The World Congress on Engineering 2014. Newswood Limited, Hong Kong, pp. 1436-1440. ISBN 978-988-19253-5-0 ISSN 2078-0958 (Print), 2078-0966 (Online)

Mallik, Sabuj and Mehdawi, Ahmed Z. El (2014) Shear strength and fracture surface studies of ball grid array (BGA) flexible surface-mount electronics packaging under isothermal ageing. In: Yang, Gi-Chul, Ao, Sio-Iong and Gelman, Len, (eds.) Transactions on Engineering Technologies. Special Volume of the World Congress on Engineering 2013. Springer Netherlands, pp. 31-41. ISBN 9789401788311 (doi:https://doi.org/10.1007/978-94-017-8832-8_3)

Solder joint

Mallik, Sabuj and Kaiser, Franziska (2014) Reliability study of subsea electronic systems subjected to accelerated thermal cycle ageing. In: Proceedings of The World Congress on Engineering 2014. Newswood Limited, Hong Kong, pp. 1436-1440. ISBN 978-988-19253-5-0 ISSN 2078-0958 (Print), 2078-0966 (Online)

Mallik, Sabuj and Mehdawi, Ahmed Z. El (2014) Shear strength and fracture surface studies of ball grid array (BGA) flexible surface-mount electronics packaging under isothermal ageing. In: Yang, Gi-Chul, Ao, Sio-Iong and Gelman, Len, (eds.) Transactions on Engineering Technologies. Special Volume of the World Congress on Engineering 2013. Springer Netherlands, pp. 31-41. ISBN 9789401788311 (doi:https://doi.org/10.1007/978-94-017-8832-8_3)