96.5Sn3.0Ag0.5Cu lead-free solder

Kamara, E., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Thomas, O., Di Maio, D., Hunt, C. and Fulton, I. (2012) Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue. In: European Microelectronics and Packaging. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4673-0694-2

Ball Grid Arrays (BGAs)

Kamara, E., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Thomas, O., Di Maio, D., Hunt, C. and Fulton, I. (2012) Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue. In: European Microelectronics and Packaging. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4673-0694-2

concave joints

Kamara, E., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Thomas, O., Di Maio, D., Hunt, C. and Fulton, I. (2012) Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue. In: European Microelectronics and Packaging. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4673-0694-2

solder isothermal fatigue failure

Kamara, E., Lu, H. ORCID: https://orcid.org/0000-0002-4392-6562, Thomas, O., Di Maio, D., Hunt, C. and Fulton, I. (2012) Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue. In: European Microelectronics and Packaging. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4673-0694-2