Items where Author is "Flynn, D."

Group by: Item Type | Uncontrolled Keywords | No Grouping

acoustic streaming aspect ratio electrodeposition electrodeposition of copper electrolyte fluid flow electroplating fibre optic hydrophone fluid flow high aspect ratio microvias megasonic agitation micro-particle imaging velocimetry (micro-PIV) printed circuit board (PCB)

Number of items: 14.

acoustic streaming

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 , Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

aspect ratio

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 , Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

electrodeposition

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 , Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

electrodeposition of copper

Costello, S., Strusevich, N., Flynn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2013) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. Microsystem Technologies, 19 (6). pp. 783-790. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-013-1746-7)

electrolyte fluid flow

Costello, S., Strusevich, N., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 , Flynn, D., Kay, R.W., Price, D., Bennett, M., Jones, A.C., Habeshaw, R., Demore, C., Cochran, S. and Desmulliez, M.P.Y. (2011) Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 9780956808606

electroplating

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 , Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

fibre optic hydrophone

Costello, S., Strusevich, N., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 , Flynn, D., Kay, R.W., Price, D., Bennett, M., Jones, A.C., Habeshaw, R., Demore, C., Cochran, S. and Desmulliez, M.P.Y. (2011) Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 9780956808606

fluid flow

Costello, S., Strusevich, N., Flynn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2013) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. Microsystem Technologies, 19 (6). pp. 783-790. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-013-1746-7)

high aspect ratio microvias

Costello, S., Strusevich, N., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 , Flynn, D., Kay, R.W., Price, D., Bennett, M., Jones, A.C., Habeshaw, R., Demore, C., Cochran, S. and Desmulliez, M.P.Y. (2011) Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 9780956808606

megasonic agitation

Costello, S., Strusevich, N., Flynn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2013) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. Microsystem Technologies, 19 (6). pp. 783-790. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-013-1746-7)

Costello, S., Flynn, D., Kay, R.W., Desmulliez, M.P.Y., Strusevich, N., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 , Jones, A.C., Bennett, M., Price, D., Habeshaw, R., Demore, C. and Cochran, S. (2011) Electrodeposition of copper into PCB vias under megasonic agitation. In: MME 2011. Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. MME2011, Norway, pp. 266-269. ISBN 9788278602249

micro-particle imaging velocimetry (micro-PIV)

Costello, S., Strusevich, N., Flynn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2013) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. Microsystem Technologies, 19 (6). pp. 783-790. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:https://doi.org/10.1007/s00542-013-1746-7)

Costello, S., Strusevich, N., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 , Flynn, D., Kay, R.W., Price, D., Bennett, M., Jones, A.C., Habeshaw, R., Demore, C., Cochran, S. and Desmulliez, M.P.Y. (2011) Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 9780956808606

printed circuit board (PCB)

Costello, S., Strusevich, N., Patel, M.K., Bailey, C. ORCID: 0000-0002-9438-3879 , Flynn, D., Kay, R.W., Price, D., Bennett, M., Jones, A.C., Habeshaw, R., Demore, C., Cochran, S. and Desmulliez, M.P.Y. (2011) Characterisation of ion transportation during electroplating of high aspect ratio microvias using megasonic agitation. In: EMPC-2011: 18th European Microelectronics and Packaging Conference. Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 1-7. ISBN 9780956808606

This list was generated on Fri Nov 22 03:17:33 2024 UTC.