Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2011.10.011)

Jackson, Gavin J., Lu, Hua ORCID: 0000-0002-4392-6562 , Durairaj, Raj, Hoo, Nick, Bailey, Chris ORCID: 0000-0002-9438-3879 , Ekere, Ndy N. and Wright, Jon (2004) Intermetallic phase detection in lead-free solders using synchrotron X-ray diffraction. Journal of Electronic Materials, 33 (12). pp. 1524-1529. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-004-0094-x)