Ridout, Stephen, Bailey, Christopher ORCID: 0000-0002-9438-3879 , Dusek, Milos and Hunt, C (2007) Constitutive modeling of kinematic-hardening and damage in solder joints. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 927-933. ISBN 1-4244-0552-1 (doi:https://doi.org/10.1109/ESTC.2006.280122)

Ridout, Stephen, Dusek, Milos, Bailey, Christopher ORCID: 0000-0002-9438-3879 and Hunt, Chris (2006) Assessing the performance of crack detection tests for solder joints. Microelectronics Reliability, 46 (12). pp. 2122-2130. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2006.05.001)

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2005) Modeling and experiments on an isothermal fatigue test for solder joints. In: Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2005. EuroSimE 2005. IEEE, Piscataway, NJ, USA, pp. 478-482. ISBN 0-7803-9062-8 (doi:https://doi.org/10.1109/ESIME.2005.1502852)

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) Finite element modelling of crack detection tests. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 141-146. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304033)

Ridout, Stephen, Dusek, Milos, Bailey, Chris ORCID: 0000-0002-9438-3879 and Hunt, Chris (2004) The effect of thermal cycle profiles on solder joint damage. In: Proceedings of the 6th International Conference on Electronics Materials and Packaging (EMAP 2004). Institute of Electrical and Electronics Engineers, pp. 436-441. ISBN 983251486X