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Items where Author is "Dunne, Fionn P. E."

Items where Author is "Dunne, Fionn P. E."

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crystal plasticity failure finite element analysis microstructure multi-scale modelling SAC305 solder joints thermal fatigue
Number of items: 8.

crystal plasticity

Xian, Jingwei, Xu, Yilun, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Coyle, Richard, Dunne, Fionn P. E. and Gourlay, Christopher (2024) The role of microstructure in the thermal fatigue of solder joints. Nature Communications, 15:4258. pp. 1-15. ISSN 2041-1723 (doi:https://doi.org/10.1038/s41467-024-48532-6)

failure

Xian, Jingwei, Xu, Yilun, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Coyle, Richard, Dunne, Fionn P. E. and Gourlay, Christopher (2024) The role of microstructure in the thermal fatigue of solder joints. Nature Communications, 15:4258. pp. 1-15. ISSN 2041-1723 (doi:https://doi.org/10.1038/s41467-024-48532-6)

finite element analysis

Xian, Jingwei, Xu, Yilun, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Coyle, Richard, Dunne, Fionn P. E. and Gourlay, Christopher (2024) The role of microstructure in the thermal fatigue of solder joints. Nature Communications, 15:4258. pp. 1-15. ISSN 2041-1723 (doi:https://doi.org/10.1038/s41467-024-48532-6)

microstructure

Xian, Jingwei, Xu, Yilun, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Coyle, Richard, Dunne, Fionn P. E. and Gourlay, Christopher (2024) The role of microstructure in the thermal fatigue of solder joints. Nature Communications, 15:4258. pp. 1-15. ISSN 2041-1723 (doi:https://doi.org/10.1038/s41467-024-48532-6)

multi-scale modelling

Xian, Jingwei, Xu, Yilun, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Coyle, Richard, Dunne, Fionn P. E. and Gourlay, Christopher (2024) The role of microstructure in the thermal fatigue of solder joints. Nature Communications, 15:4258. pp. 1-15. ISSN 2041-1723 (doi:https://doi.org/10.1038/s41467-024-48532-6)

SAC305

Xian, Jingwei, Xu, Yilun, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Coyle, Richard, Dunne, Fionn P. E. and Gourlay, Christopher (2024) The role of microstructure in the thermal fatigue of solder joints. Nature Communications, 15:4258. pp. 1-15. ISSN 2041-1723 (doi:https://doi.org/10.1038/s41467-024-48532-6)

solder joints

Xian, Jingwei, Xu, Yilun, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Coyle, Richard, Dunne, Fionn P. E. and Gourlay, Christopher (2024) The role of microstructure in the thermal fatigue of solder joints. Nature Communications, 15:4258. pp. 1-15. ISSN 2041-1723 (doi:https://doi.org/10.1038/s41467-024-48532-6)

thermal fatigue

Xian, Jingwei, Xu, Yilun, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Coyle, Richard, Dunne, Fionn P. E. and Gourlay, Christopher (2024) The role of microstructure in the thermal fatigue of solder joints. Nature Communications, 15:4258. pp. 1-15. ISSN 2041-1723 (doi:https://doi.org/10.1038/s41467-024-48532-6)

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