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Items where Author is "Di Maio, D."

Items where Author is "Di Maio, D."

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96.5Sn3.0Ag0.5Cu lead-free solder Ball Grid Arrays (BGAs) chiral structures concave joints impact damage detection lead-free solders nonlinear acoustics piezo-ceramic transducers reliability solder isothermal fatigue failure vibration
Number of items: 11.

96.5Sn3.0Ag0.5Cu lead-free solder

Kamara, E., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Thomas, O., Di Maio, D., Hunt, C. and Fulton, I. (2012) Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue. In: European Microelectronics and Packaging. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4673-0694-2

Ball Grid Arrays (BGAs)

Kamara, E., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Thomas, O., Di Maio, D., Hunt, C. and Fulton, I. (2012) Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue. In: European Microelectronics and Packaging. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4673-0694-2

chiral structures

Klepka, A., Staszewski, W.J., Uhl, T., Di Maio, D., Scarpa, F. and Tee, K.F. ORCID logoORCID: https://orcid.org/0000-0003-3202-873X (2012) Impact damage detection in composite chiral sandwich panels. Key Engineering Materials, 518. pp. 160-167. ISSN 1013-9826 (Print), 1662-9795 (Online) (doi:10.4028/www.scientific.net/KEM.518.160)

concave joints

Kamara, E., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Thomas, O., Di Maio, D., Hunt, C. and Fulton, I. (2012) Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue. In: European Microelectronics and Packaging. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4673-0694-2

impact damage detection

Klepka, A., Staszewski, W.J., Uhl, T., Di Maio, D., Scarpa, F. and Tee, K.F. ORCID logoORCID: https://orcid.org/0000-0003-3202-873X (2012) Impact damage detection in composite chiral sandwich panels. Key Engineering Materials, 518. pp. 160-167. ISSN 1013-9826 (Print), 1662-9795 (Online) (doi:10.4028/www.scientific.net/KEM.518.160)

lead-free solders

Kamara, E., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:10.1016/j.microrel.2010.07.152)

nonlinear acoustics

Klepka, A., Staszewski, W.J., Uhl, T., Di Maio, D., Scarpa, F. and Tee, K.F. ORCID logoORCID: https://orcid.org/0000-0003-3202-873X (2012) Impact damage detection in composite chiral sandwich panels. Key Engineering Materials, 518. pp. 160-167. ISSN 1013-9826 (Print), 1662-9795 (Online) (doi:10.4028/www.scientific.net/KEM.518.160)

piezo-ceramic transducers

Klepka, A., Staszewski, W.J., Uhl, T., Di Maio, D., Scarpa, F. and Tee, K.F. ORCID logoORCID: https://orcid.org/0000-0003-3202-873X (2012) Impact damage detection in composite chiral sandwich panels. Key Engineering Materials, 518. pp. 160-167. ISSN 1013-9826 (Print), 1662-9795 (Online) (doi:10.4028/www.scientific.net/KEM.518.160)

reliability

Kamara, E., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:10.1016/j.microrel.2010.07.152)

solder isothermal fatigue failure

Kamara, E., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Thomas, O., Di Maio, D., Hunt, C. and Fulton, I. (2012) Modelling and experimental measurement of multiple joint lead free solder interconnects subjected to low cycle mechanical fatigue. In: European Microelectronics and Packaging. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 1-6. ISBN 978-1-4673-0694-2

vibration

Kamara, E., Lu, H. ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Bailey, C. ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Hunt, C., Di Maio, D. and Thomas, O. (2010) A multi-disciplinary study of vibration based reliability of lead-free electronic interconnects. Microelectronics Reliability, 50 (9-11). pp. 1706-1710. ISSN 0026-2714 (doi:10.1016/j.microrel.2010.07.152)

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