Items where Author is "Dhinsa, Kulvir"
computational fluid dynamics (CFD)
Dhinsa, Kulvir, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis
ORCID: https://orcid.org/0000-0002-7426-9999
(2005)
Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications.
IEEE Transactions on Components and Packaging Technologies, 28 (4).
pp. 686-699.
ISSN 1521-3331
(doi:10.1109/TCAPT.2005.859758)
electronic applications
Dhinsa, Kulvir, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis
ORCID: https://orcid.org/0000-0002-7426-9999
(2005)
Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications.
IEEE Transactions on Components and Packaging Technologies, 28 (4).
pp. 686-699.
ISSN 1521-3331
(doi:10.1109/TCAPT.2005.859758)
fluid flow
Dhinsa, Kulvir, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis
ORCID: https://orcid.org/0000-0002-7426-9999
(2005)
Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications.
IEEE Transactions on Components and Packaging Technologies, 28 (4).
pp. 686-699.
ISSN 1521-3331
(doi:10.1109/TCAPT.2005.859758)
heat transfer
Dhinsa, Kulvir, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis
ORCID: https://orcid.org/0000-0002-7426-9999
(2005)
Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications.
IEEE Transactions on Components and Packaging Technologies, 28 (4).
pp. 686-699.
ISSN 1521-3331
(doi:10.1109/TCAPT.2005.859758)
turbulence models
Dhinsa, Kulvir, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Pericleous, Koulis
ORCID: https://orcid.org/0000-0002-7426-9999
(2005)
Investigation into the performance of turbulence models for fluid flow and heat transfer phenomena in electronic applications.
IEEE Transactions on Components and Packaging Technologies, 28 (4).
pp. 686-699.
ISSN 1521-3331
(doi:10.1109/TCAPT.2005.859758)