accelerated stress test

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2018.2859031)

convection oven

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2018.2859031)

encapsulation

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2018.2859031)

microelectronics packaging

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2018.2859031)

microwave curing

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2018.2859031)

open-ended oven

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2018.2859031)

reliability testing

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2018.2859031)

residual stress

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879, Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2018.2859031)