deformation

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Tim ORCID: 0000-0001-8307-6403 , Amalou, Farid, Cargill, Scott, Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc (2011) Modelling and optimisation study on the fabrication of nano-structures using imprint forming process. Engineering Computations, 28 (1). pp. 93-111. ISSN 0264-4401 (doi:https://doi.org/10.1108/02644401111097046)

electroplating

Strusevich, Nadia, Bailey, Chris ORCID: 0000-0002-9438-3879 , Costello, Suzanne, Patel, Mayur and Desmulliez, Marc (2013) Numerical modeling of the electroplating process for microvia fabrication. In: 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA. ISBN 9781467361385 (doi:https://doi.org/10.1109/EuroSimE.2013.6529989)

finite element analysis

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Tim ORCID: 0000-0001-8307-6403 , Amalou, Farid, Cargill, Scott, Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc (2011) Modelling and optimisation study on the fabrication of nano-structures using imprint forming process. Engineering Computations, 28 (1). pp. 93-111. ISSN 0264-4401 (doi:https://doi.org/10.1108/02644401111097046)

manufacturing systems

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Tim ORCID: 0000-0001-8307-6403 , Amalou, Farid, Cargill, Scott, Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc (2011) Modelling and optimisation study on the fabrication of nano-structures using imprint forming process. Engineering Computations, 28 (1). pp. 93-111. ISSN 0264-4401 (doi:https://doi.org/10.1108/02644401111097046)

microvia fabrication

Strusevich, Nadia, Bailey, Chris ORCID: 0000-0002-9438-3879 , Costello, Suzanne, Patel, Mayur and Desmulliez, Marc (2013) Numerical modeling of the electroplating process for microvia fabrication. In: 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013. Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA. ISBN 9781467361385 (doi:https://doi.org/10.1109/EuroSimE.2013.6529989)

modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Tim ORCID: 0000-0001-8307-6403 , Amalou, Farid, Cargill, Scott, Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc (2011) Modelling and optimisation study on the fabrication of nano-structures using imprint forming process. Engineering Computations, 28 (1). pp. 93-111. ISSN 0264-4401 (doi:https://doi.org/10.1108/02644401111097046)

nanotechnology

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Tim ORCID: 0000-0001-8307-6403 , Amalou, Farid, Cargill, Scott, Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc (2011) Modelling and optimisation study on the fabrication of nano-structures using imprint forming process. Engineering Computations, 28 (1). pp. 93-111. ISSN 0264-4401 (doi:https://doi.org/10.1108/02644401111097046)

optimization

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc (2009) Optimisation modelling for thermal fatigue reliability of lead-free interconnects in fine-pitch flip-chip packaging. Soldering & Surface Mount Technology, 21 (1). pp. 11-24. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910910928265)

process efficiency

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tilford, Tim ORCID: 0000-0001-8307-6403 , Amalou, Farid, Cargill, Scott, Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc (2011) Modelling and optimisation study on the fabrication of nano-structures using imprint forming process. Engineering Computations, 28 (1). pp. 93-111. ISSN 0264-4401 (doi:https://doi.org/10.1108/02644401111097046)

product reliability

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc (2009) Optimisation modelling for thermal fatigue reliability of lead-free interconnects in fine-pitch flip-chip packaging. Soldering & Surface Mount Technology, 21 (1). pp. 11-24. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910910928265)

prototypes

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc (2009) Optimisation modelling for thermal fatigue reliability of lead-free interconnects in fine-pitch flip-chip packaging. Soldering & Surface Mount Technology, 21 (1). pp. 11-24. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910910928265)

techniques

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Bailey, Chris ORCID: 0000-0002-9438-3879 and Desmulliez, Marc (2009) Optimisation modelling for thermal fatigue reliability of lead-free interconnects in fine-pitch flip-chip packaging. Soldering & Surface Mount Technology, 21 (1). pp. 11-24. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910910928265)