Items where Author is "Desmuilliez, M."

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adhesive bonding adhesives fine-pitch technology flip-chip devices LED displays microassembling organic light emitting diodes semiconductor device packaging semiconductor device reliability surface mount technology thermal management (packaging)

Number of items: 11.

adhesive bonding

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

adhesives

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

fine-pitch technology

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

flip-chip devices

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

LED displays

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

microassembling

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

organic light emitting diodes

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

semiconductor device packaging

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

semiconductor device reliability

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

surface mount technology

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

thermal management (packaging)

Stoyanov, S. ORCID: https://orcid.org/0000-0001-6091-1226, Kay, R., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmuilliez, M. and Hendriksen, M. (2003) Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives. In: Proceedings of 5th Electronics Packaging Technology Conference (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 797-802. ISBN 0780382056 (doi:10.1109/EPTC.2003.1271627)

This list was generated on Sun Dec 22 13:00:15 2024 UTC.