thermal cycling reliability

Loh, Wei-Sun, Corfield, Martin, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Hogg, Simon, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403 and Johnson, C. Mark (2007) Wire bond reliability for power electronic modules - effect of bonding temperature. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. IEEE, New York, pp. 427-432. ISBN 9781424411054 (doi:10.1109/ESIME.2007.360057)

wire bonds

Loh, Wei-Sun, Corfield, Martin, Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Hogg, Simon, Tilford, Tim ORCID: https://orcid.org/0000-0001-8307-6403 and Johnson, C. Mark (2007) Wire bond reliability for power electronic modules - effect of bonding temperature. In: Ernst, L.J., Zhang, G.Q., Rodgers, P., Meuwissen, M., Marco, S., Van Driel, W.D. and De Saint Leger, O., (eds.) EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings. IEEE, New York, pp. 427-432. ISBN 9781424411054 (doi:10.1109/ESIME.2007.360057)