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Items where Author is "Cook, A."

Items where Author is "Cook, A."

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Number of items: 5.

assembly

Tilford, Timothy ORCID: 0000-0001-8307-6403 , Cook, A., Lu, H. ORCID: 0000-0002-4392-6562 , Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Electronics Systemintegration Technology Conference, 16-18 Sep 2014, Helsinki, Finland. (doi:https://doi.org/10.1109/ESTC.2014.6962815)

heating

Tilford, Timothy ORCID: 0000-0001-8307-6403 , Cook, A., Lu, H. ORCID: 0000-0002-4392-6562 , Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Electronics Systemintegration Technology Conference, 16-18 Sep 2014, Helsinki, Finland. (doi:https://doi.org/10.1109/ESTC.2014.6962815)

material properties

Tilford, Timothy ORCID: 0000-0001-8307-6403 , Cook, A., Lu, H. ORCID: 0000-0002-4392-6562 , Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Electronics Systemintegration Technology Conference, 16-18 Sep 2014, Helsinki, Finland. (doi:https://doi.org/10.1109/ESTC.2014.6962815)

temperature distribution

Tilford, Timothy ORCID: 0000-0001-8307-6403 , Cook, A., Lu, H. ORCID: 0000-0002-4392-6562 , Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Electronics Systemintegration Technology Conference, 16-18 Sep 2014, Helsinki, Finland. (doi:https://doi.org/10.1109/ESTC.2014.6962815)

thermal conductivity

Tilford, Timothy ORCID: 0000-0001-8307-6403 , Cook, A., Lu, H. ORCID: 0000-0002-4392-6562 , Ramambasoa, A. and Conseil, F. (2014) Numerical analysis of the performance of highly oriented pyrolytic graphite heat spreader in thermal management of microelectronics assemblies. In: Electronics Systemintegration Technology Conference, 16-18 Sep 2014, Helsinki, Finland. (doi:https://doi.org/10.1109/ESTC.2014.6962815)

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