Items where Author is "Conway, P.P."

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chip-on-board packaging circuit optimisation design of experiments finite element analysis flip-chip devices integrated optoelectronics optical backplanes optical backplanes optical planar waveguides optical interconnects optical waveguides photodiodes surface emitting lasers thermal expansion

Number of items: 14.

chip-on-board packaging

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

circuit optimisation

Gwyer, D., Misselbrook, P., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304070)

design of experiments

Gwyer, D., Misselbrook, P., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304070)

finite element analysis

Gwyer, D., Misselbrook, P., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304070)

flip-chip devices

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

integrated optoelectronics

Gwyer, D., Misselbrook, P., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304070)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

optical backplanes

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

optical backplanes optical planar waveguides

Gwyer, D., Misselbrook, P., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304070)

optical interconnects

Misselbrook, P., Gwyer, David, Bailey, Christopher, Conway, P.P. and Williams, K. (2007) Review of the technology and reliability issues arising as optical interconnects migrate onto the circuit board. In: Lee, Y. C., Wong, C. P. and Suhir, Ephraim, (eds.) Micro- and opto-electronic materials and structures: physics, mechanics, design, reliability, packaging. Springer, Boston, pp. 361-382. ISBN 978038727974 9 (doi:10.1007/0-387-32989-7_34)

optical waveguides photodiodes

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

surface emitting lasers

Gwyer, D., Misselbrook, P., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:10.1109/ESIME.2004.1304070)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

thermal expansion

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:10.1109/ITHERM.2004.1318311)

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