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Items where Author is "Conference Committee, ESTC/IEEE 2024"

Items where Author is "Conference Committee, ESTC/IEEE 2024"

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Finite Element Method (FEM) Model Order Reduction (MOR) Power Electronics Module (PEM) reliability assessment thermal-mechanical analysis
Number of items: 5.

Finite Element Method (FEM)

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2024) Reduced-order modelling for coupled thermal-mechanical analysis and reliability assessment of power electronic modules with nonlinear material behaviours. In: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). Electronics System-Integration Technology Conference, ESTC . Institute of Electrical and Electronics Engineers (IEEE), Berlin, Germany; Piscataway, New Jersey, pp. 1-8. ISBN 979-8350390360 ISSN 2687-9700 (Print), 2687-9727 (Online) (doi:https://doi.org/10.1109/ESTC60143.2024.10712079)

Model Order Reduction (MOR)

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2024) Reduced-order modelling for coupled thermal-mechanical analysis and reliability assessment of power electronic modules with nonlinear material behaviours. In: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). Electronics System-Integration Technology Conference, ESTC . Institute of Electrical and Electronics Engineers (IEEE), Berlin, Germany; Piscataway, New Jersey, pp. 1-8. ISBN 979-8350390360 ISSN 2687-9700 (Print), 2687-9727 (Online) (doi:https://doi.org/10.1109/ESTC60143.2024.10712079)

Power Electronics Module (PEM)

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2024) Reduced-order modelling for coupled thermal-mechanical analysis and reliability assessment of power electronic modules with nonlinear material behaviours. In: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). Electronics System-Integration Technology Conference, ESTC . Institute of Electrical and Electronics Engineers (IEEE), Berlin, Germany; Piscataway, New Jersey, pp. 1-8. ISBN 979-8350390360 ISSN 2687-9700 (Print), 2687-9727 (Online) (doi:https://doi.org/10.1109/ESTC60143.2024.10712079)

reliability assessment

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2024) Reduced-order modelling for coupled thermal-mechanical analysis and reliability assessment of power electronic modules with nonlinear material behaviours. In: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). Electronics System-Integration Technology Conference, ESTC . Institute of Electrical and Electronics Engineers (IEEE), Berlin, Germany; Piscataway, New Jersey, pp. 1-8. ISBN 979-8350390360 ISSN 2687-9700 (Print), 2687-9727 (Online) (doi:https://doi.org/10.1109/ESTC60143.2024.10712079)

thermal-mechanical analysis

Hassan, Sheikh ORCID: 0000-0002-6215-7340 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517 and Bailey, Christopher ORCID: 0000-0002-9438-3879 (2024) Reduced-order modelling for coupled thermal-mechanical analysis and reliability assessment of power electronic modules with nonlinear material behaviours. In: 2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC). Electronics System-Integration Technology Conference, ESTC . Institute of Electrical and Electronics Engineers (IEEE), Berlin, Germany; Piscataway, New Jersey, pp. 1-8. ISBN 979-8350390360 ISSN 2687-9700 (Print), 2687-9727 (Online) (doi:https://doi.org/10.1109/ESTC60143.2024.10712079)

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