Items where Author is "Conference Committee, EMPC"
Conference Proceedings
Hassan, Sheikh ORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah
ORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan
ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879
(2024)
Thermal-mechanical analysis of a power module with parametric model order reduction.
In: 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom.
IEEE Xplore
.
The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-6.
ISBN 978-0956808691; 978-1665487368
(doi:10.23919/EMPC55870.2023.10418328)