Conference Proceedings

Hassan, Sheikh ORCID: https://orcid.org/0000-0002-6215-7340, Sherriff, Mark, Agyakwa, Pearl, Paul, Evans and Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 (2025) Thermal analysis of power electronic modules with parametric Model Order Reduction. In: 25th European Microelectronics and Packaging Conference and Exhibition (EMPC) 15th - 18th Sept. 2025, Grenoble, France. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-8. ISBN 978-1739500511 (doi:10.23919/EMPC63132.2025.11222433)

Hassan, Sheikh ORCID: https://orcid.org/0000-0002-6215-7340, Rajaguru, Pushparajah ORCID: https://orcid.org/0000-0002-6041-0517, Stoyanov, Stoyan ORCID: https://orcid.org/0000-0001-6091-1226 and Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879 (2024) Thermal-mechanical analysis of a power module with parametric model order reduction. In: 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom. IEEE Xplore . The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-6. ISBN 978-0956808691; 978-1665487368 (doi:10.23919/EMPC55870.2023.10418328)