design process

Rajaguru, Pushpa ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tang, Ying Kit, Bailey, Chris ORCID: 0000-0002-9438-3879 , Claverley, James, Leach, Richard and Topham, David (2010) Numerical modelling methodology for design of miniaturised integrated products - an application to 3D CMM micro-probe development. 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Computer Society, Piscataway NJ. ISBN 9781424470266 (doi:https://doi.org/10.1109/ESIME.2010.5464573)

failure

Rajaguru, Pushpa ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tang, Ying Kit, Bailey, Chris ORCID: 0000-0002-9438-3879 , Claverley, James, Leach, Richard and Topham, David (2010) Numerical modelling methodology for design of miniaturised integrated products - an application to 3D CMM micro-probe development. 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Computer Society, Piscataway NJ. ISBN 9781424470266 (doi:https://doi.org/10.1109/ESIME.2010.5464573)

micro-probe

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Rajaguru, Pushpa ORCID: 0000-0002-6041-0517 , Tang, Ying Kit, Bailey, Chris ORCID: 0000-0002-9438-3879 , Claverley, James and Leach, Richard (2010) Reduced order modelling for risk mitigation in design of miniaturised/integrated products. In: ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings. IEEE Computer Society, Piscataway, USA, pp. 402-407. ISBN 9781424478491 (print), 9781424478507 (online) (doi:https://doi.org/10.1109/ISSE.2010.5547362)

novel micro-integrated products

Rajaguru, Pushpa ORCID: 0000-0002-6041-0517 , Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Tang, Ying Kit, Bailey, Chris ORCID: 0000-0002-9438-3879 , Claverley, James, Leach, Richard and Topham, David (2010) Numerical modelling methodology for design of miniaturised integrated products - an application to 3D CMM micro-probe development. 2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010. IEEE Computer Society, Piscataway NJ. ISBN 9781424470266 (doi:https://doi.org/10.1109/ESIME.2010.5464573)

reduced order models

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Rajaguru, Pushpa ORCID: 0000-0002-6041-0517 , Tang, Ying Kit, Bailey, Chris ORCID: 0000-0002-9438-3879 , Claverley, James and Leach, Richard (2010) Reduced order modelling for risk mitigation in design of miniaturised/integrated products. In: ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings. IEEE Computer Society, Piscataway, USA, pp. 402-407. ISBN 9781424478491 (print), 9781424478507 (online) (doi:https://doi.org/10.1109/ISSE.2010.5547362)

three-dimensional miniaturised products

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226 , Rajaguru, Pushpa ORCID: 0000-0002-6041-0517 , Tang, Ying Kit, Bailey, Chris ORCID: 0000-0002-9438-3879 , Claverley, James and Leach, Richard (2010) Reduced order modelling for risk mitigation in design of miniaturised/integrated products. In: ISSE 2010 - 33rd International Spring Seminar on Electronics Technology: Polymer Electronics and Nanotechnologies: Towards System Integration - Conference Proceedings. IEEE Computer Society, Piscataway, USA, pp. 402-407. ISBN 9781424478491 (print), 9781424478507 (online) (doi:https://doi.org/10.1109/ISSE.2010.5547362)