Items where Author is "Chan, Yan-Cheong"
(ACF)
Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong
(2005)
Moisture effects on the reliability of ACF interconnections.
Electronics World, 111 (1836).
pp. 20-24.
ISSN 1365-4675
adhesives
Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong
(2004)
Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives.
IEEE Transactions on Electronics Packaging Manufacturing, 27 (4).
pp. 254-259.
ISSN 1521-334X
(doi:10.1109/TEPM.2004.843152)
anisotropic conductive film
Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong
(2005)
Moisture effects on the reliability of ACF interconnections.
Electronics World, 111 (1836).
pp. 20-24.
ISSN 1365-4675
anisotropic media
Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong
(2004)
Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives.
IEEE Transactions on Electronics Packaging Manufacturing, 27 (4).
pp. 254-259.
ISSN 1521-334X
(doi:10.1109/TEPM.2004.843152)
finite element analysis
Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong
(2004)
Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives.
IEEE Transactions on Electronics Packaging Manufacturing, 27 (4).
pp. 254-259.
ISSN 1521-334X
(doi:10.1109/TEPM.2004.843152)
flip chip technology
Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong
(2005)
Moisture effects on the reliability of ACF interconnections.
Electronics World, 111 (1836).
pp. 20-24.
ISSN 1365-4675
flip-chip devices
Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong
(2004)
Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives.
IEEE Transactions on Electronics Packaging Manufacturing, 27 (4).
pp. 254-259.
ISSN 1521-334X
(doi:10.1109/TEPM.2004.843152)
integrated circuit interconnections
Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong
(2004)
Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives.
IEEE Transactions on Electronics Packaging Manufacturing, 27 (4).
pp. 254-259.
ISSN 1521-334X
(doi:10.1109/TEPM.2004.843152)
integrated circuit reliability
Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong
(2004)
Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives.
IEEE Transactions on Electronics Packaging Manufacturing, 27 (4).
pp. 254-259.
ISSN 1521-334X
(doi:10.1109/TEPM.2004.843152)
moisture
Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong
(2005)
Moisture effects on the reliability of ACF interconnections.
Electronics World, 111 (1836).
pp. 20-24.
ISSN 1365-4675
reflow soldering
Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong
(2004)
Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives.
IEEE Transactions on Electronics Packaging Manufacturing, 27 (4).
pp. 254-259.
ISSN 1521-334X
(doi:10.1109/TEPM.2004.843152)
thermal expansion
Yin, Chunyan ORCID: https://orcid.org/0000-0003-0298-0420, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Chris
ORCID: https://orcid.org/0000-0002-9438-3879 and Chan, Yan-Cheong
(2004)
Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives.
IEEE Transactions on Electronics Packaging Manufacturing, 27 (4).
pp. 254-259.
ISSN 1521-334X
(doi:10.1109/TEPM.2004.843152)