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Items where Author is "Chamund, Dinesh"

Items where Author is "Chamund, Dinesh"

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copper insulated gate bipolar transistors multichip modules reliability soldering substrates
Number of items: 6.

copper

Newcombe, D.R., Chamund, Dinesh, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2010) Reliability metrics for IGBT power modules. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 670-674. ISBN 9781424481408 (doi:10.1109/ICEPT.2010.5582869)

insulated gate bipolar transistors

Newcombe, D.R., Chamund, Dinesh, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2010) Reliability metrics for IGBT power modules. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 670-674. ISBN 9781424481408 (doi:10.1109/ICEPT.2010.5582869)

multichip modules

Newcombe, D.R., Chamund, Dinesh, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2010) Reliability metrics for IGBT power modules. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 670-674. ISBN 9781424481408 (doi:10.1109/ICEPT.2010.5582869)

reliability

Newcombe, D.R., Chamund, Dinesh, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2010) Reliability metrics for IGBT power modules. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 670-674. ISBN 9781424481408 (doi:10.1109/ICEPT.2010.5582869)

soldering

Newcombe, D.R., Chamund, Dinesh, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2010) Reliability metrics for IGBT power modules. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 670-674. ISBN 9781424481408 (doi:10.1109/ICEPT.2010.5582869)

substrates

Newcombe, D.R., Chamund, Dinesh, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 and Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562 (2010) Reliability metrics for IGBT power modules. In: Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 670-674. ISBN 9781424481408 (doi:10.1109/ICEPT.2010.5582869)

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