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Items where Author is "Braun, Jessica"

Items where Author is "Braun, Jessica"

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3D printing additive manufacturing Design tools Electronics packaging inkjet printing microelectronics fabrication Modelling numerical analysis reliability
Number of items: 10.

3D printing

Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.04.008)

additive manufacturing

Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2021) Comparative reliability of inkjet-printed electronics packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2). pp. 351-362. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2021.3049952)

Design tools

Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.04.008)

Electronics packaging

Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.04.008)

inkjet printing

Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2021) Comparative reliability of inkjet-printed electronics packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2). pp. 351-362. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2021.3049952)

microelectronics fabrication

Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2021) Comparative reliability of inkjet-printed electronics packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2). pp. 351-362. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2021.3049952)

Modelling

Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.04.008)

numerical analysis

Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2021) Comparative reliability of inkjet-printed electronics packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2). pp. 351-362. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2021.3049952)

reliability

Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Christoph, Patel, Mayur K. and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2021) Comparative reliability of inkjet-printed electronics packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 11 (2). pp. 351-362. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:10.1109/TCPMT.2021.3049952)

Tilford, Tim ORCID logoORCID: https://orcid.org/0000-0001-8307-6403, Stoyanov, Stoyan ORCID logoORCID: https://orcid.org/0000-0001-6091-1226, Braun, Jessica, Janhsen, Jan Cristophe, Burgard, Matthias, Birch, Richard and Bailey, Chris ORCID logoORCID: https://orcid.org/0000-0002-9438-3879 (2018) Design, manufacture and test for reliable 3D printed electronics packaging. Microelectronics Reliability, 85. pp. 109-117. ISSN 0026-2714 (doi:10.1016/j.microrel.2018.04.008)

This list was generated on Sun Dec 22 14:30:10 2024 UTC.