Items where Author is "Bhatti, R.S."
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Up a levelautomotive
Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:10.1016/j.microrel.2011.05.001)
automotive applications
Otiaba, K.C., Bhatti, R.S., Ekere, N.N., Mallik, S., Amalu, E.H. and Ekpu, M. (2011) Thermal effects of die-attach voids location and style on performance of chip level package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 231-236. ISBN 9781467307581 (doi:10.1109/ICASTech.2011.6145176)
binder
Shehu, T. and Bhatti, R.S. (2012) The use of Yam flour (starch) as binder for sand mould production in Nigeria. World Applied Sciences Journal, 16 (6). pp. 858-862. ISSN 1818-495 (doi:wasj/wasj16(6)12/14.pdf)
carbon nanofibres (CNFs)
Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S. and Amalu, E.H. (2011) Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-8. ISBN 978-1-4673-0694-2 (print)
carbon nanotubes (CNTs)
Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S. and Amalu, E.H. (2011) Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-8. ISBN 978-1-4673-0694-2 (print)
chemical vapour deposition (CVD)
Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S. and Amalu, E.H. (2011) Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-8. ISBN 978-1-4673-0694-2 (print)
chip scale package (CSP) technology
Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:10.1016/j.microrel.2012.01.015)
chip-scale packaged power device
Otiaba, K.C., Bhatti, R.S., Ekere, N.N., Mallik, S., Amalu, E.H. and Ekpu, M. (2011) Thermal effects of die-attach voids location and style on performance of chip level package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 231-236. ISBN 9781467307581 (doi:10.1109/ICASTech.2011.6145176)
defective metallisation
Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:10.1016/j.microrel.2012.01.015)
electronic control unit
Otiaba, K.C., Ekere, N.N., Amalu, E.H., Bhatti, R.S. and Mallik, S. (2012) Thermal management materials for electronic control unit: trends, processing technology and R and D challenges. Advanced Materials Research, 367. pp. 301-307. ISSN 1022-6680 (Print), 1662-8985 (Online) (doi:10.4028/www.scientific.net/AMR.367.301)
Otiaba, K.C., Ekere, N.N., Amalu, E.H., Bhatti, R.S. and Mallik, S. (2010) Thermal management materials for electronic control unit: trends, processing technology and R&D challenges. In: International Conference on Engineering Research & Development: Advances in Engineering Science & Technology, 7-9 September 2010, Benin City, Africa.
electronic control unit (ECU)
Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S. and Amalu, E.H. (2011) Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-8. ISBN 978-1-4673-0694-2 (print)
electronic unit
Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:10.1016/j.microrel.2011.05.001)
Euro 6 standard
Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S. and Amalu, E.H. (2011) Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-8. ISBN 978-1-4673-0694-2 (print)
fatigue failure
Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S. and Ekpu, M. (2012) Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach. Engineering Failure Analysis, 28. pp. 192-207. ISSN 1350-6307 (doi:10.1016/j.engfailanal.2012.10.008)
Amalu, E.H., Ekere, N.N., Bhatti, R.S., Mallik, S., Takyi, G. and Ibhadode, A.O.A. (2011) Numerical investigation of thermo-mechanical behaviour of ball grid array solder joint at high temperature excursion. Advanced Materials Research, 367. pp. 287-292. ISSN 1662-8985 (Print), 1022-6680 (Online) (doi:10.4028/www.scientific.net/AMR.367.287)
finite element analysis
Otiaba, Kenny C., Okereke, M.I. 
ORCID: https://orcid.org/0000-0002-2104-012X and Bhatti, R.S.
(2014)
Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material.
Applied Thermal Engineering, 64 (1–2).
51 - 63.
ISSN 1359-4311
(doi:10.1016/j.applthermaleng.2013.12.006)
Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S. and Ekpu, M. (2012) Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach. Engineering Failure Analysis, 28. pp. 192-207. ISSN 1350-6307 (doi:10.1016/j.engfailanal.2012.10.008)
finite element analysis (FEA)
Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:10.1016/j.microrel.2012.01.015)
flip chip
Amalu, Emeka H., Lui, Y.T., Ekere, Ndy, Bhatti, R.S. and Takyi, G. (2011) Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity. In: AIP Conference Proceedings. American Institute of Physics, Melville, NY, USA, pp. 639-644. (doi:10.1063/1.3552519)
foundry
Shehu, T. and Bhatti, R.S. (2012) The use of Yam flour (starch) as binder for sand mould production in Nigeria. World Applied Sciences Journal, 16 (6). pp. 858-862. ISSN 1818-495 (doi:wasj/wasj16(6)12/14.pdf)
high temperature electronics
Amalu, E.H., Ekere, N.N., Bhatti, R.S., Mallik, S., Takyi, G. and Ibhadode, A.O.A. (2011) Numerical investigation of thermo-mechanical behaviour of ball grid array solder joint at high temperature excursion. Advanced Materials Research, 367. pp. 287-292. ISSN 1662-8985 (Print), 1022-6680 (Online) (doi:10.4028/www.scientific.net/AMR.367.287)
HTE
Amalu, E.H., Ekere, N.N. and Bhatti, R.S. (2010) High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology. In: 2nd International Conference on Adaptive Science & Technology, 2009. (ICAST 2009). Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 146-153. ISBN 978-1-4244-3522-7 ISSN 0855-8906 (doi:10.1109/ICASTECH.2009.5409731)
interface
Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:10.1016/j.microrel.2011.05.001)
lead-free solder
Otiaba, K.C., Bhatti, R.S., Ekere, N.N., Mallik, S., Amalu, E.H. and Ekpu, M. (2011) Thermal effects of die-attach voids location and style on performance of chip level package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 231-236. ISBN 9781467307581 (doi:10.1109/ICASTech.2011.6145176)
lead-free soldering
Amalu, Emeka H., Lui, Y.T., Ekere, Ndy, Bhatti, R.S. and Takyi, G. (2011) Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity. In: AIP Conference Proceedings. American Institute of Physics, Melville, NY, USA, pp. 639-644. (doi:10.1063/1.3552519)
life prediction
Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S. and Ekpu, M. (2012) Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach. Engineering Failure Analysis, 28. pp. 192-207. ISSN 1350-6307 (doi:10.1016/j.engfailanal.2012.10.008)
materials
Otiaba, K.C., Ekere, N.N., Amalu, E.H., Bhatti, R.S. and Mallik, S. (2012) Thermal management materials for electronic control unit: trends, processing technology and R and D challenges. Advanced Materials Research, 367. pp. 301-307. ISSN 1022-6680 (Print), 1662-8985 (Online) (doi:10.4028/www.scientific.net/AMR.367.301)
Amalu, E.H., Ekere, N.N. and Bhatti, R.S. (2010) High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology. In: 2nd International Conference on Adaptive Science & Technology, 2009. (ICAST 2009). Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 146-153. ISBN 978-1-4244-3522-7 ISSN 0855-8906 (doi:10.1109/ICASTECH.2009.5409731)
Otiaba, K.C., Ekere, N.N., Amalu, E.H., Bhatti, R.S. and Mallik, S. (2010) Thermal management materials for electronic control unit: trends, processing technology and R&D challenges. In: International Conference on Engineering Research & Development: Advances in Engineering Science & Technology, 7-9 September 2010, Benin City, Africa.
miniaturization
Amalu, Emeka H., Lui, Y.T., Ekere, Ndy, Bhatti, R.S. and Takyi, G. (2011) Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity. In: AIP Conference Proceedings. American Institute of Physics, Melville, NY, USA, pp. 639-644. (doi:10.1063/1.3552519)
Amalu, E.H., Ekere, N.N. and Bhatti, R.S. (2010) High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology. In: 2nd International Conference on Adaptive Science & Technology, 2009. (ICAST 2009). Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 146-153. ISBN 978-1-4244-3522-7 ISSN 0855-8906 (doi:10.1109/ICASTECH.2009.5409731)
moulding sand
Shehu, T. and Bhatti, R.S. (2012) The use of Yam flour (starch) as binder for sand mould production in Nigeria. World Applied Sciences Journal, 16 (6). pp. 858-862. ISSN 1818-495 (doi:wasj/wasj16(6)12/14.pdf)
nanotechnology
Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S. and Amalu, E.H. (2011) Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-8. ISBN 978-1-4673-0694-2 (print)
out-gassing phenomenon
Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:10.1016/j.microrel.2012.01.015)
packaging
Amalu, E.H., Ekere, N.N. and Bhatti, R.S. (2010) High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology. In: 2nd International Conference on Adaptive Science & Technology, 2009. (ICAST 2009). Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 146-153. ISBN 978-1-4244-3522-7 ISSN 0855-8906 (doi:10.1109/ICASTECH.2009.5409731)
Pb-free solder
Amalu, E.H., Lau, W.K., Ekere, N.N., Bhatti, R.S., Mallik, S., Otiaba, K.C. and Takyi, G. (2011) A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits. Microelectronic Engineering, 88 (7). pp. 1610-1617. ISSN 0167-9317 (doi:10.1016/j.mee.2011.02.104)
processing technology
Otiaba, K.C., Ekere, N.N., Amalu, E.H., Bhatti, R.S. and Mallik, S. (2012) Thermal management materials for electronic control unit: trends, processing technology and R and D challenges. Advanced Materials Research, 367. pp. 301-307. ISSN 1022-6680 (Print), 1662-8985 (Online) (doi:10.4028/www.scientific.net/AMR.367.301)
Otiaba, K.C., Ekere, N.N., Amalu, E.H., Bhatti, R.S. and Mallik, S. (2010) Thermal management materials for electronic control unit: trends, processing technology and R&D challenges. In: International Conference on Engineering Research & Development: Advances in Engineering Science & Technology, 7-9 September 2010, Benin City, Africa.
reflow profile
Amalu, E.H., Lau, W.K., Ekere, N.N., Bhatti, R.S., Mallik, S., Otiaba, K.C. and Takyi, G. (2011) A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits. Microelectronic Engineering, 88 (7). pp. 1610-1617. ISSN 0167-9317 (doi:10.1016/j.mee.2011.02.104)
Amalu, Emeka H., Lui, Y.T., Ekere, Ndy, Bhatti, R.S. and Takyi, G. (2011) Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity. In: AIP Conference Proceedings. American Institute of Physics, Melville, NY, USA, pp. 639-644. (doi:10.1063/1.3552519)
representative volume element
Otiaba, Kenny C., Okereke, M.I. ORCID: https://orcid.org/0000-0002-2104-012X and Bhatti, R.S.
(2014)
Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material.
Applied Thermal Engineering, 64 (1–2).
51 - 63.
ISSN 1359-4311
(doi:10.1016/j.applthermaleng.2013.12.006)
solder deposit
Amalu, E.H., Lau, W.K., Ekere, N.N., Bhatti, R.S., Mallik, S., Otiaba, K.C. and Takyi, G. (2011) A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits. Microelectronic Engineering, 88 (7). pp. 1610-1617. ISSN 0167-9317 (doi:10.1016/j.mee.2011.02.104)
solder die attach
Otiaba, K.C., Bhatti, R.S., Ekere, N.N., Ekpu, M. and Adeyemi, J. (2011) Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device. In: Collection of Papers Presented at the 17th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC' 2011). EDA Publishing Association, Grenoble, France, pp. 115-119. ISBN 9782355000188
solder die-attach
Otiaba, Kenny C., Okereke, M.I. ORCID: https://orcid.org/0000-0002-2104-012X and Bhatti, R.S.
(2014)
Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material.
Applied Thermal Engineering, 64 (1–2).
51 - 63.
ISSN 1359-4311
(doi:10.1016/j.applthermaleng.2013.12.006)
solder joint integrity
Amalu, Emeka H., Lui, Y.T., Ekere, Ndy, Bhatti, R.S. and Takyi, G. (2011) Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity. In: AIP Conference Proceedings. American Institute of Physics, Melville, NY, USA, pp. 639-644. (doi:10.1063/1.3552519)
solder joint reliability
Amalu, E.H., Ekere, N.N., Bhatti, R.S., Mallik, S., Takyi, G. and Ibhadode, A.O.A. (2011) Numerical investigation of thermo-mechanical behaviour of ball grid array solder joint at high temperature excursion. Advanced Materials Research, 367. pp. 287-292. ISSN 1662-8985 (Print), 1022-6680 (Online) (doi:10.4028/www.scientific.net/AMR.367.287)
solder thermal interface materials (STIMs)
Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:10.1016/j.microrel.2012.01.015)
Otiaba, K.C., Bhatti, R.S., Ekere, N.N., Mallik, S., Amalu, E.H. and Ekpu, M. (2011) Thermal effects of die-attach voids location and style on performance of chip level package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 231-236. ISBN 9781467307581 (doi:10.1109/ICASTech.2011.6145176)
solder voids
Otiaba, Kenny C., Okereke, M.I. ORCID: https://orcid.org/0000-0002-2104-012X and Bhatti, R.S.
(2014)
Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material.
Applied Thermal Engineering, 64 (1–2).
51 - 63.
ISSN 1359-4311
(doi:10.1016/j.applthermaleng.2013.12.006)
stencil printing
Amalu, E.H., Lau, W.K., Ekere, N.N., Bhatti, R.S., Mallik, S., Otiaba, K.C. and Takyi, G. (2011) A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits. Microelectronic Engineering, 88 (7). pp. 1610-1617. ISSN 0167-9317 (doi:10.1016/j.mee.2011.02.104)
surface mount components
Amalu, E.H., Ekere, N.N., Bhatti, R.S., Mallik, S., Takyi, G. and Ibhadode, A.O.A. (2011) Numerical investigation of thermo-mechanical behaviour of ball grid array solder joint at high temperature excursion. Advanced Materials Research, 367. pp. 287-292. ISSN 1662-8985 (Print), 1022-6680 (Online) (doi:10.4028/www.scientific.net/AMR.367.287)
surface mount packages
Amalu, E.H., Lau, W.K., Ekere, N.N., Bhatti, R.S., Mallik, S., Otiaba, K.C. and Takyi, G. (2011) A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits. Microelectronic Engineering, 88 (7). pp. 1610-1617. ISSN 0167-9317 (doi:10.1016/j.mee.2011.02.104)
thermal
Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:10.1016/j.microrel.2011.05.001)
thermal cycling
Amalu, E.H., Ekere, N.N., Bhatti, R.S., Mallik, S., Takyi, G. and Ibhadode, A.O.A. (2011) Numerical investigation of thermo-mechanical behaviour of ball grid array solder joint at high temperature excursion. Advanced Materials Research, 367. pp. 287-292. ISSN 1662-8985 (Print), 1022-6680 (Online) (doi:10.4028/www.scientific.net/AMR.367.287)
thermal fatigue
Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S. and Ekpu, M. (2012) Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach. Engineering Failure Analysis, 28. pp. 192-207. ISSN 1350-6307 (doi:10.1016/j.engfailanal.2012.10.008)
thermal interface materials (TIMs)
Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S. and Amalu, E.H. (2011) Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-8. ISBN 978-1-4673-0694-2 (print)
thermal management
Otiaba, K.C., Ekere, N.N., Amalu, E.H., Bhatti, R.S. and Mallik, S. (2012) Thermal management materials for electronic control unit: trends, processing technology and R and D challenges. Advanced Materials Research, 367. pp. 301-307. ISSN 1022-6680 (Print), 1662-8985 (Online) (doi:10.4028/www.scientific.net/AMR.367.301)
Otiaba, K.C., Ekere, N.N., Amalu, E.H., Bhatti, R.S. and Mallik, S. (2010) Thermal management materials for electronic control unit: trends, processing technology and R&D challenges. In: International Conference on Engineering Research & Development: Advances in Engineering Science & Technology, 7-9 September 2010, Benin City, Africa.
thermo-mechanical reliability
Otiaba, Kenny C., Okereke, M.I. ORCID: https://orcid.org/0000-0002-2104-012X and Bhatti, R.S.
(2014)
Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material.
Applied Thermal Engineering, 64 (1–2).
51 - 63.
ISSN 1359-4311
(doi:10.1016/j.applthermaleng.2013.12.006)
three-dimensional finite element analysis
Otiaba, K.C., Bhatti, R.S., Ekere, N.N., Mallik, S., Amalu, E.H. and Ekpu, M. (2011) Thermal effects of die-attach voids location and style on performance of chip level package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 231-236. ISBN 9781467307581 (doi:10.1109/ICASTech.2011.6145176)
transfer efficiency
Amalu, E.H., Lau, W.K., Ekere, N.N., Bhatti, R.S., Mallik, S., Otiaba, K.C. and Takyi, G. (2011) A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits. Microelectronic Engineering, 88 (7). pp. 1610-1617. ISSN 0167-9317 (doi:10.1016/j.mee.2011.02.104)
under-hood automotive ambient
Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S. and Amalu, E.H. (2011) Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-8. ISBN 978-1-4673-0694-2 (print)
voids and thermal resistance
Otiaba, K.C., Bhatti, R.S., Ekere, N.N., Ekpu, M. and Adeyemi, J. (2011) Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device. In: Collection of Papers Presented at the 17th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC' 2011). EDA Publishing Association, Grenoble, France, pp. 115-119. ISBN 9782355000188
yam flour
Shehu, T. and Bhatti, R.S. (2012) The use of Yam flour (starch) as binder for sand mould production in Nigeria. World Applied Sciences Journal, 16 (6). pp. 858-862. ISSN 1818-495 (doi:wasj/wasj16(6)12/14.pdf)