Conference or Conference Paper

Bernasko, Peter, Mallik, Sabuj, Ekere, Ndy and Takyi, G. (2011) Evaluating the effect of pad sizes on the inter-metallic layer formation and growth for Sn-Ag-Cu solders on Cu metallization. In: International Conference on Electronics Packaging (ICEP) 2011, 13-15 April 2011, Nara Prefectural New Public Hall, Nara, Japan.