Article

Takyi, G., Amalu, E.H. and Bernasko, P.K. (2011) Effect of solder joint integrity on the thermal performance of a TEC for a 980nm pump laser module. Soldering and Surface Mount Technology, 23 (2). pp. 115-119. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540911111120186)

Conference Proceedings

Bernasko, P.K., Mallik, S., Ekere, N.N., Seman, A. and Tayki, G. (2010) Effect of reflow profile and thermal cycle ageing on the intermetallic formation and growth in lead-free soldering. In: Electronics Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 986-990. ISBN 978-1-4244-5100-5 (electronic), 978-1-4244-5099-2 (print) (doi:https://doi.org/10.1109/EPTC.2009.5416398)