Mallik, S., Bauer, R., Hübner, F. and Ekere, N.N. (2011) Evaluating print performance of Sn-Ag-Cu leadfree solder pastes used in electronics assembly process. In: International Conference on Advances in Materials and Processing Technologies (AMPT2010). AIP Conference Proceedings (1315/1). American Institute of Physics (AIP), Melville, NY, USA, pp. 33-38. ISBN 978-0-7354-0871-5 ISSN 0094-243X (doi:10.1063/1.3552465)

Mallik, Sabuj, Thieme, Jens, Bauer, R., Ekere, Ndy, Seman, Anton, Bhatti, Rajinderpal and Durairaj, Rajkumar (2010) Study of the rheological behaviour of Sn-Ag-Cu solder pastes and their correlation with printing performance. In: EPTC 2009 Proceedings of 2009 11th Electronics Packaging Technology Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 869-874. ISBN 978-1-4244-5099-2 (Print), 978-1-4244-5100-5 (e-ISBN) (doi:10.1109/EPTC.2009.5416423)

Mallik, S., Schmidt, M., Bauer, R. and Ekere, N.N. (2010) Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance. Soldering & Surface Mount Technology, 22 (4). pp. 42-49. ISSN 0954-0911 (doi:10.1108/09540911011076871)

Mallik, Sabuj, Schmidt, M., Bauer, R. and Ekere, Ndy (2008) Influence of solder paste components on rheological behaviour. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, Inc., New York, USA, pp. 1135-1140. ISBN 9781424428137 (doi:10.1109/ESTC.2008.4684512)

Ekere, Ndy, Durairaj, Rajkumar, Mallik, Sabuj, Marks, Antony, Bauer, R. and Winter, M. (2006) Rheological characterisation of new lead-free solder paste formulations for flip-chip assembly. ESTC 2006: 1st Electronics Systemintegration Technology Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 995-1000. ISBN 1424405521 (doi:10.1109/ESTC.2006.280132)