Skip navigation

Items where Author is "Bartholomew, Martin"

Items where Author is "Bartholomew, Martin"

[up] Up a level
Group by: Item Type | Uncontrolled Keywords | No Grouping
active matrix liquid crystal display AMLCD computational mechanics micro-electronic displays optical performance thermo-mechanics
Number of items: 11.

active matrix liquid crystal display

Lee, Yek Bing, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Riches, Steve and Bartholomew, Martin (2006) Predicting the behaviour of micro-electronic displays using computational mechanics. In: 14th Annual Joint Conference of the Association for Computational Mechanics in Engineering (ACME) and the Irish Society for Scientific and Engineering Computation (ISSEC), Queen's University of Belfast.

Lee, Yek, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Thermo-mechanical analysis of the packaging process for micro-electronic displays. 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. IEEE Computer Society, pp. 190-195. ISBN 1 4244 0275 1 (doi:10.1109/ESIME.2006.1644051)

AMLCD

Lee, Yek, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1214-1217. ISBN 9781424405527 (doi:10.1109/ESTC.2006.280164)

Lee, Yek Bing, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Riches, Steve and Bartholomew, Martin (2006) Predicting the behaviour of micro-electronic displays using computational mechanics. In: 14th Annual Joint Conference of the Association for Computational Mechanics in Engineering (ACME) and the Irish Society for Scientific and Engineering Computation (ISSEC), Queen's University of Belfast.

Lee, Yek, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Thermo-mechanical analysis of the packaging process for micro-electronic displays. 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. IEEE Computer Society, pp. 190-195. ISBN 1 4244 0275 1 (doi:10.1109/ESIME.2006.1644051)

computational mechanics

Lee, Yek Bing, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Riches, Steve and Bartholomew, Martin (2006) Predicting the behaviour of micro-electronic displays using computational mechanics. In: 14th Annual Joint Conference of the Association for Computational Mechanics in Engineering (ACME) and the Irish Society for Scientific and Engineering Computation (ISSEC), Queen's University of Belfast.

micro-electronic displays

Lee, Yek Bing, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Riches, Steve and Bartholomew, Martin (2006) Predicting the behaviour of micro-electronic displays using computational mechanics. In: 14th Annual Joint Conference of the Association for Computational Mechanics in Engineering (ACME) and the Irish Society for Scientific and Engineering Computation (ISSEC), Queen's University of Belfast.

Lee, Yek, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Thermo-mechanical analysis of the packaging process for micro-electronic displays. 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. IEEE Computer Society, pp. 190-195. ISBN 1 4244 0275 1 (doi:10.1109/ESIME.2006.1644051)

optical performance

Lee, Yek, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1214-1217. ISBN 9781424405527 (doi:10.1109/ESTC.2006.280164)

thermo-mechanics

Lee, Yek, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Analysis of the thermo mechanical effects on packaging process of performance enhanced AMLCD's and the optical performance of the display. Proceedings of the 1st Electronics Systemintegration Technology Conference, 2006. IEEE, pp. 1214-1217. ISBN 9781424405527 (doi:10.1109/ESTC.2006.280164)

Lee, Yek, Bailey, Christopher ORCID logoORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua ORCID logoORCID: https://orcid.org/0000-0002-4392-6562, Riches, Steve, Bartholomew, Martin and Tebbit, Nigel (2006) Thermo-mechanical analysis of the packaging process for micro-electronic displays. 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, 2006. EuroSime 2006. IEEE Computer Society, pp. 190-195. ISBN 1 4244 0275 1 (doi:10.1109/ESIME.2006.1644051)

This list was generated on Sun Dec 22 14:10:32 2024 UTC.