accelerated temperature cycle (ATC)

Amalu, E.H, Ekere, N.N. and Aminu, G. (2011) Effects of inter-metallic compound on high temperature reliability of flip chip interconnects for fine pitch applications. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 208-213. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145173)

finite element analysis (FEA)

Amalu, E.H, Ekere, N.N. and Aminu, G. (2011) Effects of inter-metallic compound on high temperature reliability of flip chip interconnects for fine pitch applications. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 208-213. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145173)

flip chip (FC)

Amalu, E.H, Ekere, N.N. and Aminu, G. (2011) Effects of inter-metallic compound on high temperature reliability of flip chip interconnects for fine pitch applications. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 208-213. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145173)

inter-metallic compound (IMC)

Amalu, E.H, Ekere, N.N. and Aminu, G. (2011) Effects of inter-metallic compound on high temperature reliability of flip chip interconnects for fine pitch applications. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 208-213. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145173)

printed circuit boards (PCBs)

Amalu, E.H, Ekere, N.N. and Aminu, G. (2011) Effects of inter-metallic compound on high temperature reliability of flip chip interconnects for fine pitch applications. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 208-213. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145173)

solder joint

Amalu, E.H, Ekere, N.N. and Aminu, G. (2011) Effects of inter-metallic compound on high temperature reliability of flip chip interconnects for fine pitch applications. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 208-213. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145173)