Article

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2011.10.011)

Amalu, Emeka H., Ekere, Ndy and Mallik, Sabuj (2011) Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process. Materials and Design, 32 (6). pp. 3189-3197. ISSN 0261-3069 (doi:https://doi.org/10.1016/j.matdes.2011.02.045)

Conference Proceedings

Amalu, Emeka H., Lui, Y.T., Ekere, Ndy, Bhatti, R.S. and Takyi, G. (2011) Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity. In: AIP Conference Proceedings. American Institute of Physics, Melville, NY, USA, pp. 639-644. (doi:https://doi.org/10.1063/1.3552519)