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Items where Author is "Amalu, E.H"

Items where Author is "Amalu, E.H"

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Conference Proceedings

Amalu, E.H, Ekere, N.N. and Aminu, G. (2011) Effects of inter-metallic compound on high temperature reliability of flip chip interconnects for fine pitch applications. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 208-213. ISBN 9781467307581 (doi:

This list was generated on Sun May 31 20:01:08 2020 UTC.