Items where Author is "Alam, M. O."
Book Section
Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Lu, Hua
ORCID: https://orcid.org/0000-0002-4392-6562, Stoyanov, Stoyan
ORCID: https://orcid.org/0000-0001-6091-1226, Tilford, Timothy, Xue, Xiangdong, Alam, M. O., Yin, Chunyan
ORCID: https://orcid.org/0000-0003-0298-0420 and Hughes, Michael
(2008)
Modelling technologies and applications.
In: Morris, James E., (ed.)
Nanopackaging: Nanotechnologies and Electronics Packaging.
Springer Science+Business Media, LLC, New York, USA, pp. 15-38.
ISBN 978-0-387-47325-3 (Print) 978-0-387-47326-0 (Online)
(doi:10.1007/978-0-387-47325-3_2)
Alam, M. O., Lu, Hua ORCID: https://orcid.org/0000-0002-4392-6562, Bailey, Christopher
ORCID: https://orcid.org/0000-0002-9438-3879, Chan, Y.C. and Wu, B.Y.
(2007)
Shear strength analysis of ball grid array (BGA) solder interfaces.
In: Vaidyanathan, K., Tee, T.Y. and Lee, T.K., (eds.)
2007 9th Electronics Packaging Technology Conference.
Electronics Packaging Technology Conference Proceedings
.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 770-773.
ISBN 9781424413249
(doi:11.1109/EPTC.2007.4469797)
Alam, M. O., Bailey, Christopher ORCID: https://orcid.org/0000-0002-9438-3879, Wu, B.Y., Yang, Dan and Chan, Y.C.
(2007)
High current density induced damage mechanisms in electronic solder joints: a state-of-the-art review.
HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration.
Institute of Electrical and Electronics Engineers, Inc., New York, pp. 93-99.
ISBN 9781424412525
(doi:10.1109/HDP.2007.4283569)