Items where Author is "Adamietz, Raphael"
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accelerated stress test
Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim
ORCID: 0000-0001-8307-6403
, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Schreier-Alt, Thomas and Warmuth, Jens
(2018)
Reliability testing and stress measurement of QFN
packages encapsulated by an open-ended microwave
curing system.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1).
pp. 173-180.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2018.2859031)
convection oven
Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim
ORCID: 0000-0001-8307-6403
, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Schreier-Alt, Thomas and Warmuth, Jens
(2018)
Reliability testing and stress measurement of QFN
packages encapsulated by an open-ended microwave
curing system.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1).
pp. 173-180.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2018.2859031)
encapsulation
Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim
ORCID: 0000-0001-8307-6403
, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Schreier-Alt, Thomas and Warmuth, Jens
(2018)
Reliability testing and stress measurement of QFN
packages encapsulated by an open-ended microwave
curing system.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1).
pp. 173-180.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2018.2859031)
microelectronics packaging
Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim
ORCID: 0000-0001-8307-6403
, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Schreier-Alt, Thomas and Warmuth, Jens
(2018)
Reliability testing and stress measurement of QFN
packages encapsulated by an open-ended microwave
curing system.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1).
pp. 173-180.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2018.2859031)
microwave curing
Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim
ORCID: 0000-0001-8307-6403
, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Schreier-Alt, Thomas and Warmuth, Jens
(2018)
Reliability testing and stress measurement of QFN
packages encapsulated by an open-ended microwave
curing system.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1).
pp. 173-180.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2018.2859031)
open-ended oven
Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim
ORCID: 0000-0001-8307-6403
, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Schreier-Alt, Thomas and Warmuth, Jens
(2018)
Reliability testing and stress measurement of QFN
packages encapsulated by an open-ended microwave
curing system.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1).
pp. 173-180.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2018.2859031)
reliability testing
Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim
ORCID: 0000-0001-8307-6403
, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Schreier-Alt, Thomas and Warmuth, Jens
(2018)
Reliability testing and stress measurement of QFN
packages encapsulated by an open-ended microwave
curing system.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1).
pp. 173-180.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2018.2859031)
residual stress
Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim
ORCID: 0000-0001-8307-6403
, Bailey, Chris
ORCID: 0000-0002-9438-3879
, Schreier-Alt, Thomas and Warmuth, Jens
(2018)
Reliability testing and stress measurement of QFN
packages encapsulated by an open-ended microwave
curing system.
IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1).
pp. 173-180.
ISSN 2156-3950 (Print), 2156-3985 (Online)
(doi:https://doi.org/10.1109/TCPMT.2018.2859031)