Skip navigation

Items where Author is "Adamietz, Raphael"

Items where Author is "Adamietz, Raphael"

Up a level
Export as [feed] RSS
Group by: Item Type | Uncontrolled Keywords | No Grouping
Number of items: 8.

accelerated stress test

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

convection oven

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

encapsulation

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

microelectronics packaging

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

microwave curing

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

open-ended oven

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

reliability testing

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

residual stress

Desmulliez, Marc P.Y, Adamietz, Raphael, Pavuluri, Sumanth K., Tilford, Tim ORCID: 0000-0001-8307-6403 , Bailey, Chris ORCID: 0000-0002-9438-3879 , Schreier-Alt, Thomas and Warmuth, Jens (2018) Reliability testing and stress measurement of QFN packages encapsulated by an open-ended microwave curing system. IEEE Transactions on Components, Packaging and Manufacturing Technology, 9 (1). pp. 173-180. ISSN 2156-3950 (Print), 2156-3985 (Online) (doi:https://doi.org/10.1109/TCPMT.2018.2859031)

This list was generated on Wed Mar 27 20:00:46 2024 UTC.