Items where Greenwich Author is "Hassan, Sheikh"
![]() | Up a level |
Article
Hassan, Sheikh
ORCID: 0000-0002-6215-7340
, Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
, Bailey, Chris and Tilford, Timothy
ORCID: 0000-0001-8307-6403
(2024)
Coupled thermal-mechanical analysis of power electronic modules with finite element method and parametric model order reduction.
Power Electronic Devices and Components:100063.
ISSN 2772-3704 (Online)
(doi:https://doi.org/10.1016/j.pedc.2024.100063)
Conference Proceedings
Hassan, Sheikh
ORCID: 0000-0002-6215-7340
, Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
and Bailey, Christopher
ORCID: 0000-0002-9438-3879
(2024)
Thermal-mechanical analysis of a power module with parametric model order reduction.
In: 24th European Microelectronics and Packaging Conference & Exhibition (EMPC). 11-14 September 2023. Cambridge, United Kingdom.
IEEE Xplore
.
The Institute of Electrical and Electronics Engineers (IEEE), Piscataway, New Jersey, pp. 1-6.
ISBN 978-0956808691; 978-1665487368
(doi:https://doi.org/10.23919/EMPC55870.2023.10418328)
Hassan, Sheikh
ORCID: 0000-0002-6215-7340
, Rajaguru, Pushparajah
ORCID: 0000-0002-6041-0517
, Stoyanov, Stoyan
ORCID: 0000-0001-6091-1226
and Bailey, Christopher
ORCID: 0000-0002-9438-3879
(2023)
Parametrising temperature dependent properties in thermal-mechanical analysis of power electronics modules using parametric Model Order Reduction.
In: 2023 46th International Spring Seminar on Electronics Technology (ISSE). 10th - 14th May 2023. Timisoara, Romania.
IEEE Xplore
.
Institute of Electrical and Electronics Engineers IEEE, Piscataway, NJ, pp. 1-7.
ISBN 979-8350334845; 979-8350334852
ISSN 2161-2528 (Print), 2161-2536 (Online)
(doi:https://doi.org/10.1109/ISSE57496.2023.10168468)