intermetallic compounds, Sn-Ag-Cu, solder, shear strength

Bernasko, Peter K., Mallik, Sabuj and Takyi, G. (2015) Effect of intermetallic compound layer thickness on the shear strength of 1206 chip resistor solder joint. Soldering & Surface Mount Technology, 27 (1). pp. 52-58. ISSN 0954-0911 (doi:https://doi.org/10.1108/SSMT-07-2013-0019)

lead-free soldering

Bernasko, P.K., Mallik, S., Ekere, N.N., Seman, A. and Tayki, G. (2010) Effect of reflow profile and thermal cycle ageing on the intermetallic formation and growth in lead-free soldering. In: Electronics Packaging Technology. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 986-990. ISBN 978-1-4244-5100-5 (electronic), 978-1-4244-5099-2 (print) (doi:https://doi.org/10.1109/EPTC.2009.5416398)

reflow parameters, shear strength, normal probability plot, solder joint, chip resistors

Bernasko, Peter K., Mallik, Sabuj and Takyi, G. (2014) Effect of reflow profile parameters on surface mount chip resistor solder joint shear strength. International Journal of Materials Science and Applications, 3 (5). pp. 254-259. ISSN 2327-2635 (Print), 2327-2643 (Online) (doi:https://doi.org/10.11648/j.ijmsa.20140305.27)