HTE, miniaturization, materials, packaging

Amalu, E.H., Ekere, N.N. and Bhatti, R.S. (2010) High temperature electronics: R&D challenges and trends in materials, packaging and interconnection technology. In: 2nd International Conference on Adaptive Science & Technology, 2009. (ICAST 2009). Institute of Electrical and Electronics Engineers, Piscataway, NJ, USA, pp. 146-153. ISBN 978-1-4244-3522-7 ISSN 0855-8906 (doi:https://doi.org/10.1109/ICASTECH.2009.5409731)

acoustic testing, coolers, lasers, microscopy, solder, thermoelectricity

Takyi, G., Amalu, E.H. and Bernasko, P.K. (2011) Effect of solder joint integrity on the thermal performance of a TEC for a 980nm pump laser module. Soldering and Surface Mount Technology, 23 (2). pp. 115-119. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540911111120186)

adhesives, elastic and plastic behaviour, non-destructive testing, NDT

Amalu, Emeka H., Ekere, Ndy and Mallik, Sabuj (2011) Evaluation of rheological properties of lead-free solder pastes and their relationship with transfer efficiency during stencil printing process. Materials and Design, 32 (6). pp. 3189-3197. ISSN 0261-3069 (doi:https://doi.org/10.1016/j.matdes.2011.02.045)

chip scale package (CSP) technology, solder thermal interface materials (STIMs), out-gassing phenomenon, defective metallisation, finite element analysis (FEA)

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2012.01.015)

chip-scale packaged power device, automotive applications, solder thermal interface materials (STIMs), three-dimensional finite element analysis, lead-free solder

Otiaba, K.C., Bhatti, R.S., Ekere, N.N., Mallik, S., Amalu, E.H. and Ekpu, M. (2011) Thermal effects of die-attach voids location and style on performance of chip level package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 231-236. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145176)

high temperature electronics, solder joint reliability, surface mount components, thermal cycling, fatigue failure

Amalu, E.H., Ekere, N.N., Bhatti, R.S., Mallik, S., Takyi, G. and Ibhadode, A.O.A. (2011) Numerical investigation of thermo-mechanical behaviour of ball grid array solder joint at high temperature excursion. Advanced Materials Research, 367. pp. 287-292. ISSN 1662-8985 (Print), 1022-6680 (Online) (doi:https://doi.org/10.4028/www.scientific.net/AMR.367.287)

microelectronics, thermal efficiency, heat sink geometry, aluminium, copper

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy, Mallik, Sabuj, Amalu, Emeka and Otiaba, Kenny (2011) Investigation of effects of heat sinks on thermal performance of microelectronic package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 127-132. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145164)

power electronics, high temperature electronics, flip chip, Pb-free solder, intermetallic compound, microelectronics reliability, fatigue failures, solder joint

Amalu, Emeka H. and Ekere, Ndy N. (2011) High temperature reliability of lead-free solder joints in a flip chip assembly. Journal of Materials Processing Technology, 212 (2). pp. 471-483. ISSN 0924-0136 (doi:https://doi.org/10.1016/j.jmatprotec.2011.10.011)

reflow profile, lead-free soldering, solder joint integrity, flip chip, miniaturization

Amalu, Emeka H., Lui, Y.T., Ekere, Ndy, Bhatti, R.S. and Takyi, G. (2011) Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity. In: AIP Conference Proceedings. American Institute of Physics, Melville, NY, USA, pp. 639-644. (doi:https://doi.org/10.1063/1.3552519)

solder joint, inter-metallic compound (IMC), flip chip (FC), accelerated temperature cycle (ATC), finite element analysis (FEA), printed circuit boards (PCBs)

Amalu, E.H, Ekere, N.N. and Aminu, G. (2011) Effects of inter-metallic compound on high temperature reliability of flip chip interconnects for fine pitch applications. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 208-213. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145173)

soldering, solder alloys, high-temperature electronics, HTE, predictions, Viscoplasticity, continuum mechanics,

Amalu, Emeka Hyginus (2012) Modelling of the reliability of flip chip lead-free solder joints at high-temperature excursions. PhD thesis, University of Greenwich.

stencil printing, Pb-free solder, reflow profile, solder deposit, transfer efficiency, surface mount packages

Amalu, E.H., Lau, W.K., Ekere, N.N., Bhatti, R.S., Mallik, S., Otiaba, K.C. and Takyi, G. (2011) A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits. Microelectronic Engineering, 88 (7). pp. 1610-1617. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2011.02.104)

thermal management, electronic control unit, materials, processing technology

Otiaba, K.C., Ekere, N.N., Amalu, E.H., Bhatti, R.S. and Mallik, S. (2012) Thermal management materials for electronic control unit: trends, processing technology and R and D challenges. Advanced Materials Research, 367. pp. 301-307. ISSN 1022-6680 (Print), 1662-8985 (Online) (doi:https://doi.org/10.4028/www.scientific.net/AMR.367.301)

Otiaba, K.C., Ekere, N.N., Amalu, E.H., Bhatti, R.S. and Mallik, S. (2010) Thermal management materials for electronic control unit: trends, processing technology and R&D challenges. In: International Conference on Engineering Research & Development: Advances in Engineering Science & Technology, 7-9 September 2010, Benin City, Africa.

thermal, interface, automotive, electronic unit

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.05.001)

under-hood automotive ambient, electronic control unit (ECU), Euro 6 standard, thermal interface materials (TIMs), nanotechnology, carbon nanotubes (CNTs), carbon nanofibres (CNFs), chemical vapour deposition (CVD)

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S. and Amalu, E.H. (2011) Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-8. ISBN 978-1-4673-0694-2 (print)