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Items where Greenwich Author is "Adeyemi, Joy T."

Items where Greenwich Author is "Adeyemi, Joy T."

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Jump to: solder die attach, voids and thermal resistance
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solder die attach, voids and thermal resistance

Otiaba, K.C., Bhatti, R.S., Ekere, N.N., Ekpu, M. and Adeyemi, J. (2011) Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device. In: Collection of Papers Presented at the 17th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC' 2011). EDA Publishing Association, Grenoble, France, pp. 115-119. ISBN 9782355000188

This list was generated on Sat Dec 21 20:38:15 2024 UTC.