chip-on-board packaging, flip-chip devices, integrated optoelectronics, optical backplanes, optical waveguides photodiodes, surface emitting lasers, thermal expansion

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: 0000-0002-9438-3879 , Conway, P.P. and Williams, K. (2004) Thermal, mechanical and optical modelling of VCSEL packaging. In: The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (ITHERM 2004) [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 405-410. ISBN 0780383575 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2004.1318311)

circuit optimisation, design of experiments, finite element analysis, integrated optoelectronics, optical backplanes optical planar waveguides, surface emitting lasers

Gwyer, D., Misselbrook, P., Bailey, C. ORCID: 0000-0002-9438-3879 , Conway, P.P. and Williams, K. (2004) Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]. In: Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems EuroSimE 2004. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 399-406. ISBN 0780384202 (doi:https://doi.org/10.1109/ESIME.2004.1304070)

computer modelling, optoelectronic packages

Gwyer, D., Bailey, C. ORCID: 0000-0002-9438-3879 , Pericleous, K. ORCID: 0000-0002-7426-9999 , Philpott, D. and Misselbrook, P. (2003) Modelling the assembly and performance of optoelectronic packages. In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-electronics and Micro-systems. Proceedings of EuroSimE 2003. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 77-85. ISBN 0780370546

design of experiments, finite element analysis, integrated optoelectronics, optical backplanes, optical couplers, surface emitting lasers, thermal expansion, thermal management (packaging)

Gwyer, D., Misselbrook, P., Philpott, D., Bailey, C. ORCID: 0000-0002-9438-3879 , Conway, P. and Williams, K. (2003) VCSEL to waveguide coupling for optical backplanes. In: Proceedings of 5th Conference Electronics Packaging Technology (EPTC 2003). Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 641-646. ISBN 0780382056 (doi:https://doi.org/10.1109/EPTC.2003.1271597)

laser beam welding, semiconductor device packaging, semiconductor lasers, semiconductor process modelling, soldering, modelling, thermal, laser

Gwyer, D., Bailey, C. ORCID: 0000-0002-9438-3879 , Pericleous, K. ORCID: 0000-0002-7426-9999 , Philpott, D. and Misselbrook, P. (2002) Mathematical modelling: a laser soldering process for an optoelectronics butterfly package. In: ITHERM 2002. The Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems [Proceedings]. Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 121-127. ISBN 0780371526 ISSN 1089-9870 (doi:https://doi.org/10.1109/ITHERM.2002.1012447)