chip scale package (CSP) technology, solder thermal interface materials (STIMs), out-gassing phenomenon, defective metallisation, finite element analysis (FEA)

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S., Alam, M.O., Amalu, E.H. and Ekpu, M. (2012) Numerical study on thermal impacts of different void patterns on performance of chip-scale packaged power device. Microelectronics Reliability, 52 (7). pp. 1409-1419. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2012.01.015)

chip-scale packaged power device, automotive applications, solder thermal interface materials (STIMs), three-dimensional finite element analysis, lead-free solder

Otiaba, K.C., Bhatti, R.S., Ekere, N.N., Mallik, S., Amalu, E.H. and Ekpu, M. (2011) Thermal effects of die-attach voids location and style on performance of chip level package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 231-236. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145176)

fatigue failure, finite element analysis, life prediction, thermal fatigue

Otiaba, Kenny C., Bhatti, R.S., Ekere, N.N., Mallik, S. and Ekpu, M. (2012) Finite element analysis of the effect of silver content for Sn–Ag–Cu alloy compositions on thermal cycling reliability of solder die attach. Engineering Failure Analysis, 28. pp. 192-207. ISSN 1350-6307 (doi:https://doi.org/10.1016/j.engfailanal.2012.10.008)

microelectronics, thermal efficiency, heat sink geometry, aluminium, copper

Ekpu, Mathias, Bhatti, Raj, Ekere, Ndy, Mallik, Sabuj, Amalu, Emeka and Otiaba, Kenny (2011) Investigation of effects of heat sinks on thermal performance of microelectronic package. In: 3rd IEEE International Conference on Adaptive Science and Technology (ICAST 2011): Proceedings. IEEE Conference Publications . Institute of Electrical and Electronic Engineers, Inc., Piscataway, NJ, USA, pp. 127-132. ISBN 9781467307581 (doi:https://doi.org/10.1109/ICASTech.2011.6145164)

solder die attach, void, chip scale package, finite element analysis, thermal resistance, thermal fatigue, lead-free solder,

Otiaba, Kenny C. (2013) Thermal and thermo-mechanical performance of voided lead-free solder thermal interface materials for chip-scale packaged power device. PhD thesis, University of Greenwich.

solder die attach, voids and thermal resistance

Otiaba, K.C., Bhatti, R.S., Ekere, N.N., Ekpu, M. and Adeyemi, J. (2011) Comparative study of the effects of coalesced and distributed solder die attach voids on thermal resistance of packaged semiconductor device. In: Collection of Papers Presented at the 17th International Workshop on THERMal INvestigation of ICs and Systems (THERMINIC' 2011). EDA Publishing Association, Grenoble, France, pp. 115-119. ISBN 9782355000188

solder voids, finite element analysis, solder die-attach, thermo-mechanical reliability, representative volume element

Otiaba, Kenny C., Okereke, M.I. ORCID: 0000-0002-2104-012X and Bhatti, R.S. (2014) Numerical assessment of the effect of void morphology on thermo-mechanical performance of solder thermal interface material. Applied Thermal Engineering, 64 (1–2). 51 - 63. ISSN 1359-4311 (doi:https://doi.org/10.1016/j.applthermaleng.2013.12.006)

solders, thermal interface materials, fatigue, lead-free

Ekpu, Mathias, Bhatti, Raj, Okereke, Michael I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) Fatigue life of lead-free solder thermal interface materials at varying bond line thickness in microelectronics. Microelectronics Reliability, 54 (1). 239 - 244. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2013.08.006)

stencil printing, Pb-free solder, reflow profile, solder deposit, transfer efficiency, surface mount packages

Amalu, E.H., Lau, W.K., Ekere, N.N., Bhatti, R.S., Mallik, S., Otiaba, K.C. and Takyi, G. (2011) A study of SnAgCu solder paste transfer efficiency and effects of optimal reflow profile on solder deposits. Microelectronic Engineering, 88 (7). pp. 1610-1617. ISSN 0167-9317 (doi:https://doi.org/10.1016/j.mee.2011.02.104)

thermal constriction, micro-contact, micro-gap, chip, heat sink

Ekpu, Mathias, Bhatti, Raj, Okereke, M.I. ORCID: 0000-0002-2104-012X , Mallik, Sabuj and Otiaba, Kenny (2014) The effect of thermal constriction on heat management in a microelectronic application. Microelectronics Journal, 45 (2). 159 - 166. ISSN 0026-2692 (doi:https://doi.org/10.1016/j.mejo.2013.10.011)

thermal management, electronic control unit, materials, processing technology

Otiaba, K.C., Ekere, N.N., Amalu, E.H., Bhatti, R.S. and Mallik, S. (2012) Thermal management materials for electronic control unit: trends, processing technology and R and D challenges. Advanced Materials Research, 367. pp. 301-307. ISSN 1022-6680 (Print), 1662-8985 (Online) (doi:https://doi.org/10.4028/www.scientific.net/AMR.367.301)

Otiaba, K.C., Ekere, N.N., Amalu, E.H., Bhatti, R.S. and Mallik, S. (2010) Thermal management materials for electronic control unit: trends, processing technology and R&D challenges. In: International Conference on Engineering Research & Development: Advances in Engineering Science & Technology, 7-9 September 2010, Benin City, Africa.

thermal, interface, automotive, electronic unit

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S., Alam, M.O. and Amalu, E.H. (2011) Thermal interface materials for automotive electronic control unit: Trends, technology and R&D challenges. Microelectronics Reliability, 51 (12). pp. 2031-2043. ISSN 0026-2714 (doi:https://doi.org/10.1016/j.microrel.2011.05.001)

under-hood automotive ambient, electronic control unit (ECU), Euro 6 standard, thermal interface materials (TIMs), nanotechnology, carbon nanotubes (CNTs), carbon nanofibres (CNFs), chemical vapour deposition (CVD)

Otiaba, K.C., Ekere, N.N., Bhatti, R.S., Mallik, S. and Amalu, E.H. (2011) Emerging nanotechnology-based thermal interface materials for automotive electronic control unit application. In: Microelectronics and Packaging. Institute of Electrical and Electronic Engineers, Inc, Piscataway, NJ, USA, pp. 1-8. ISBN 978-1-4673-0694-2 (print)