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Items where Greenwich Author is "Durairaj, Rajkumar"

Items where Greenwich Author is "Durairaj, Rajkumar"

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Jump to: X-ray diffraction (XRD), synchrotron, intermetallic compounds (IMCs), lead-free solder, reliability, European Synchrotron Radiation Facility (ESRF) | advanced characterization, electronic materials, modeling processes, | assembly lines, electronics manufacturing, flip-chip assemblies, industrial production, lead-free solder pastes, printing processes, rheology, shear testing, | cement-based materials, microstructure, attenuation, stress | cement-based materials, microstructure, attenuation, viscosity, solder pastes, solder joints, | cement-based materials, microstructure, attenuation, viscosity, stress | emulsions, flow, water | flip-chip assembly, isotropic conductive adhesives, (ICA), reliability modelling | lead-free solder pastes, rheological characteristics, ageing, printing performance, flip-chip assembly, | lead-free, solder paste, rheology, viscosity, wall-slip, stencil printing process | multi-scale computational simulations, adhesive flows | rheological behaviour, solder pastes, flip-chip assembly applications, | rheological behaviours, solder pastes, printing performance | rheology, solder paste, thixotropy , stretched exponential model | rheology, solder pastes, stencils | solder paste, flux, creep, viscosity, quality control, rheology | solder paste, lead, slip, creep, rheology | solder paste, rheological characterization, simulation, particles | solder pastes, | solder pastes, isotropic conductive adhesives, | solder pastes, isotropic conductive adhesives, rheology, thixotropy, viscosity | x-rays, diffraction experiments
Number of items: 22.

X-ray diffraction (XRD), synchrotron, intermetallic compounds (IMCs), lead-free solder, reliability, European Synchrotron Radiation Facility (ESRF)

Jackson, Gavin J., Lu, Hua ORCID: 0000-0002-4392-6562, Durairaj, Raj, Hoo, Nick, Bailey, Chris ORCID: 0000-0002-9438-3879, Ekere, Ndy N. and Wright, Jon (2004) Intermetallic phase detection in lead-free solders using synchrotron X-ray diffraction. Journal of Electronic Materials, 33 (12). pp. 1524-1529. ISSN 0361-5235 (Print), 1543-186X (Online) (doi:https://doi.org/10.1007/s11664-004-0094-x)

advanced characterization, electronic materials, modeling processes,

Mallik, S., Ekere, N.N., Marks, A.E., Seman, A. and Durairaj, R. (2010) Modeling the structural breakdown of solder paste using the structural kinetic model. Journal of Materials Engineering and Performance, 19 (1). pp. 40-45. ISSN 1059-9495 (Print), 1544-1024 (Online) (doi:https://doi.org/10.1007/s11665-009-9448-0)

assembly lines, electronics manufacturing, flip-chip assemblies, industrial production, lead-free solder pastes, printing processes, rheology, shear testing,

Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2007) Effect of abandon time on print quality and rheological characteristics for lead-free solder pastes used for flip-chip assembly. 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. Ieee/Cpmt International Electronics Manufacturing Technology Symposium . Institute of Electrical and Electronics Engineers, New York, USA, pp. 14-19. ISBN 9781424413355 (doi:https://doi.org/10.1109/IEMT.2007.4417048)

cement-based materials, microstructure, attenuation, stress

Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) Development of an in-situ, non-destructive ultrasonic monitoring technique for solder pastes. 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 209-214. ISBN 9781424428137 (doi:https://doi.org/10.1109/ESTC.2008.4684351)

cement-based materials, microstructure, attenuation, viscosity, solder pastes, solder joints,

Durairaj, Rajkumar, Mallik, Sabuj, Seman, Anton, Marks, Antony and Ekere, Ndy (2008) Investigation of wall-slip effect on paste release characteristic in flip-chip stencil printing process. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1328-1333. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763615)

cement-based materials, microstructure, attenuation, viscosity, stress

Seman, Anton, Ekere, Ndy, Ashenden, Stuart J., Mallik, Sabuj, Marks, Antony and Durairaj, Rajkumar (2008) In-situ non-destructive ultrasonic rheology technique for monitoring different lead-free solder pastes for surface mount applications. 2008 10th Electronics Packaging Technology Conference (EPTC 2008). Institute of Electrical and Electronics Engineers, New York, USA, pp. 1448-1454. ISBN 9781424421176 (doi:https://doi.org/10.1109/EPTC.2008.4763635)

emulsions, flow, water

Ekere, Ndy, Mallik, Sabuj, Durairaj, Rajkumar and Marks, Antony (2007) A study of the rheological properties of lead free solder paste formulations used for flip-chip interconnection. 32nd IEEE/CPMT International Electronic Manufacturing Technology Symposium. IEEE/CPM International Electronics Manufacturing Technology Symposium . IEEE, New York, USA, pp. 165-171. ISBN 9781424413355 (doi:https://doi.org/10.1109/IEMT.2007.4417065)

flip-chip assembly, isotropic conductive adhesives, (ICA), reliability modelling

Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Bailey, Christopher ORCID: 0000-0002-9438-3879, Kay, Robert, Durairaj, Rajkumar, Hendriksen, Mike, Desmuilliez, Marc and Ekere, Ndy (2004) Assembly and reliability of isotropic conductive adhesives for fine pitch flip-chip applications. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

lead-free solder pastes, rheological characteristics, ageing, printing performance, flip-chip assembly,

Ekere, Ndy, Marks, Antony, Mallik, Sabuj and Durairaj, Rajkumar (2008) Effect of long-term aging on the rheological characteristics and printing performance of lead-free solder pastes used for flip-chip assembly. Smart Processing Technology, 2. pp. 131-134.

lead-free, solder paste, rheology, viscosity, wall-slip, stencil printing process

Durairaj, R., Man, Lam Wai, Ekere, N.N. and Mallik, S. (2010) The effect of wall-slip formation on the rheological behaviour of lead-free solder pastes. Materials and Design, 31 (3). pp. 1056-1062. ISSN 0261-3069 (doi:https://doi.org/10.1016/j.matdes.2009.09.051)

multi-scale computational simulations, adhesive flows

Glinski, G.P., Bailey, C. ORCID: 0000-0002-9438-3879, Durairaj, R. and Ekere, N.N. (2002) Rheological characterization and multi-scale computational simulations of electrically conductive adhesive flows. In: IMAPS - Europe Cracow 2002, 16-18 June 2002, Cracow, Poland.

rheological behaviour, solder pastes, flip-chip assembly applications,

Mallik, Sabuj, Ekere, Ndy, Marks, Antony, Seman, Anton and Durairaj, Rajkumar (2008) Modelling of the time-dependent flow behaviour of lead-free solder pastes used for flip-chip assembly applications. In: 2008 2nd Electronics System-Integration Technology Conference. Institute of Electrical and Electronics Engineers, New York, USA, pp. 1219-1224. ISBN 9781424428137 (doi:https://doi.org/10.1109/ESTC.2008.4684527)

rheological behaviours, solder pastes, printing performance

Mallik, Sabuj, Thieme, Jens, Bauer, R., Ekere, Ndy, Seman, Anton, Bhatti, Rajinderpal and Durairaj, Rajkumar (2010) Study of the rheological behaviour of Sn-Ag-Cu solder pastes and their correlation with printing performance. In: EPTC 2009 Proceedings of 2009 11th Electronics Packaging Technology Conference. IEEE Conference Publications . Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 869-874. ISBN 978-1-4244-5099-2 (Print), 978-1-4244-5100-5 (e-ISBN) (doi:https://doi.org/10.1109/EPTC.2009.5416423)

rheology, solder paste, thixotropy , stretched exponential model

Mallik, Sabuj, Ekere, Ndy, Seman, Anton and Durairaj, Rajkumar (2009) Modelling the time-dependent behaviour of solder pastes used in the electronics assembly applications. In: 11th Electronic Material and Packaging Conference (EMAP 2009), 1-2 Dec 2009, Penang, Malaysia. (Unpublished)

rheology, solder pastes, stencils

Durairaj, R., Jackson, G.J., Ekere, N.N., Glinski, G. and Bailey, C. ORCID: 0000-0002-9438-3879 (2002) Correlation of solder paste rheology with computational simulations of the stencil printing process. Soldering and Surface Mount Technology, 14 (1). pp. 11-17. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910210416422)

solder paste, flux, creep, viscosity, quality control, rheology

Durairaj, Rajkumar, Mallik, Sabuj and Ekere, Ndy (2008) Solder paste characterisation: towards the development of quality control (QC) tool. Soldering & Surface Mount Technology, 20 (3). pp. 34-40. ISSN 0954-0911 (doi:https://doi.org/10.1108/09540910810885705)

solder paste, lead, slip, creep, rheology

Mallik, Sabuj, Ekere, Ndy, Durairaj, Rajkumar and Marks, Antony (2008) An investigation into the rheological properties of different lead-free solder pastes for surface mount applications. Soldering & Surface Mount Technology, 20 (2). pp. 3-10. ISSN 0954-0911 (doi:1108/09540910810871511)

solder paste, rheological characterization, simulation, particles

Durairaj, Rajkumar, Ekere, Ndy, Salam, B., Jackson, G. and He, Da (2003) Monte Carlo study of solder paste microstructure and ultra-fine-pitch stencil printing. Journal of Materials Science: Materials in Electronics, 14 (8). pp. 501-506. ISSN 0957-4522 (doi:https://doi.org/10.1023/A:1023929119055)

solder pastes,

Ekere, Ndy, Durairaj, Rajkumar, Mallik, Sabuj, Marks, Antony, Bauer, R. and Winter, M. (2006) Rheological characterisation of new lead-free solder paste formulations for flip-chip assembly. ESTC 2006: 1st Electronics Systemintegration Technology Conference. Institute of Electrical and Electronics Engineers, Inc., New York, pp. 995-1000. ISBN 1424405521 (doi:https://doi.org/10.1109/ESTC.2006.280132)

solder pastes, isotropic conductive adhesives,

Durairaj, R., Mallik, S., Seman, A., Marks, A. and Ekere, N.N. (2008) Viscoelastic properties of solder paste and isotropic conductive adhesives used for flip-chip assembly. In: Electronic Manufacturing Technology Symposium (IEMT), 2008 33rd IEEE/CPMT International. Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 1-8. ISBN 9781424433926 (print), 9781424433933 (electronic) ISSN 1089-8190 (doi:https://doi.org/10.1109/IEMT.2008.5507801)

solder pastes, isotropic conductive adhesives, rheology, thixotropy, viscosity

Durairaj, Rajkumar, Man, Lam Wai, Mallik, Sabuj and Ekere, Ndy (2009) Thixotropic studies of lead-based solder, lead-free solder and conductive adhesive pastes. In: 11th Electronic Material and Packaging Conference (EMAP), 1-3 Dec 2009, Penang, Malaysia. (Unpublished)

x-rays, diffraction experiments

Hoo, Nick, Jackson, Gavin, Hendriksen, Mike, Lu, Hua ORCID: 0000-0002-4392-6562, Durairaj, Rajkumar, Bailey, Chris ORCID: 0000-0002-9438-3879, Ekere, Ndy and Wright, Jonathon (2004) In-situ synchrotron x-ray diffraction during melting and solidification of a lead-free solder paste. In: TMS 2004 133rd TMS Annual Meeting & Exhibition 2004, 14-18 Mar 2004, Charlotte, North Carolina, USA. (Unpublished)

This list was generated on Wed May 27 07:53:02 2020 UTC.