isotropic conductive adhesive materials, polymer crosslinking, cure kinetics models, Differential Scanning Calorimetry (DSC), particle swarm optimisation method

Tilford, T., Morris, J.E., Ferenets, M., Rajaguru, P.R. ORCID: 0000-0002-6041-0517 , Pavuluri, S., Desmulliez, M.P.Y. and Bailey, C. ORCID: 0000-0002-9438-3879 (2010) Numerical analysis of polymer cure kinetics in isotropic conductive adhesives. In: 33rd International Spring Seminar on Electronics Technology (ISSE), 2010. Polymer Electronics and Nanotechnologies: Towards System Integration . IEEE Xplore, Sovereign House, London, N3 1QB, UK, pp. 412-416. ISBN 978-1-4244-7849-1 (print), 978-1-4244-7850-7 (e-ISBN) (doi:https://doi.org/10.1109/ISSE.2010.5547360)