Items where Greenwich Author is "Parrott, Kevin"
British Aerospace partly funded EPSRC/D.T.I Parallel Applications Project
Monk, Peter and Parrott, Kevin (2001) Phase-accuracy comparisons and improved far-field estimates for 3-D edge elements on tetrahedral meshes. Journal of Computational Physics, 170 (2). pp. 614-641. ISSN 0021-9991 (doi:10.1006/jcph.2001.6753)
DTI under the Parallel Application Programme
Reed, Joy, Parrott, Kevin and Lanfear, Tim (1996) Portability, predictability and performance for parallel computing: BSP in practice. Concurrency: Practice and Experience, 8 (10). pp. 799-812. ISSN 1040-3108 (Print), 1096-9128 (Online) (doi:10.1002/(SICI)1096-9128(199612)8:10<799::AID-CPE274>3.0.CO;2-7)
Engineering and Physical Sciences Researc Council (EPSRC)
Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J.
(2008)
Numerical analysis of thermal stresses induced during VFM encapsulant curing.
In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353.
ISBN 978-1-4244-3972-0
(doi:10.1109/ISSE.2008.5276666)
Engineering and Physical Sciences Research Council (EPSRC)
Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J.
(2008)
Numerical simulation of encapsulant curing within a variable frequency microwave processing system.
In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-454.
ISBN 978-1-4244-2127-5
(doi:10.1109/ESIME.2008.4525086)
Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Parrott, K. and Sangster, A.J.
(2008)
Open ended microwave oven for packaging.
In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008).
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20.
ISBN 978-2-3550-0006-5
(doi:10.1109/DTIP.2008.4752943)
Engineering and Physical Sciences Research Council (EPSRC) (Grant No. EP/C534212/1)
Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Parrott, Kevin
(2009)
Polymer curing within an optimised open-ended microwave oven.
In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20.
ISBN 978-2874870064
(doi:10.1109/EUMC.2008.4751375)
European Commission (under contract number INFSO-RI- 031688)
Khalid, Omer, Anthony, Richard, Nilsson, Paul, Keahey, Kate, Schulz, Markus, Parrott, Kevin and Petridis, Miltos (2009) Enabling and optimizing pilot jobs using xen based virtual machines for the HPC grid applications. In: Virtualization technologies in distributed computing. ACM, New York, NY, USA, pp. 1-8. ISBN 9781605585802 (doi:10.1145/1555336.1555338)
Innovative Electronics Manufacturing Centre (IeMRC) (Grant No. FE/05/01/07)
Sinclair, Keith I., Goussetis, George, Desmulliez, Marc P.Y., Sangster, Alan J., Tilford, Tim, Bailey, Chris ORCID: https://orcid.org/0000-0002-9438-3879 and Parrott, Kevin
(2009)
Polymer curing within an optimised open-ended microwave oven.
In: European Microwave Week 2008, “Bridging Gaps”, Conference Proceedings,.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, N.J., USA, pp. 17-20.
ISBN 978-2874870064
(doi:10.1109/EUMC.2008.4751375)
Innovative Electronics Manufacturing Centre (IeMRC), co-ordinated by Loughborough University and by the Engineering and Physical Sciences Research Council (EPSRC)
Sinclair, K.I., Goussetis, G., Desmulliez, M.P.Y., Sangster, A.J., Tilford, T. ORCID: https://orcid.org/0000-0001-8307-6403, Bailey, C.
ORCID: https://orcid.org/0000-0002-9438-3879 and Parrott, A.K.
(2008)
Optimization of an open-ended microwave oven for microelectronics packaging.
IEEE Transactions on Microwave Theory and Techniques, 56 (11).
pp. 2635-2641.
ISSN 0018-9480
(doi:10.1109/TMTT.2008.2005925)
Innovative electronics Manufacturing Research Centre (IeMRC)
Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J.
(2008)
Numerical analysis of thermal stresses induced during VFM encapsulant curing.
In: 31st International Spring Seminar on Electronics Technology, 2008. ISSE '08.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 348-353.
ISBN 978-1-4244-3972-0
(doi:10.1109/ISSE.2008.5276666)
Tilford, T., Sinclair, K.I., Goussetis, G., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Desmulliez, M.P.Y., Parrott, A.K. and Sangster, A.J.
(2008)
Numerical simulation of encapsulant curing within a variable frequency microwave processing system.
In: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Micro-Systems, 2008. EuroSimE 2008. International Conference on.
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 447-454.
ISBN 978-1-4244-2127-5
(doi:10.1109/ESIME.2008.4525086)
Sinclair, K.I., Tilford, T., Desmulliez, M.Y.P., Goussetis, G., Bailey, C. ORCID: https://orcid.org/0000-0002-9438-3879, Parrott, K. and Sangster, A.J.
(2008)
Open ended microwave oven for packaging.
In: Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, 2008 (MEMS/MOEMS 2008).
Institute of Electrical and Electronics Engineers, Inc., Piscataway, NJ, USA, pp. 16-20.
ISBN 978-2-3550-0006-5
(doi:10.1109/DTIP.2008.4752943)
University of Greenwich
Bradshaw, Noel-Ann, Walshaw, Chris ORCID: https://orcid.org/0000-0003-0253-7779, Ierotheou, Constantinos and Parrott, A. Kevin
(2009)
A multi-objective evolutionary algorithm for portfolio optimisation.
In: Proceedings from Artificial Intelligence and Simulation of Behaviour Symposium 2009 on Evolutionary Systems.
The Society for the Study of Artificial Intelligence and Simulation of Behaviour, London, UK, pp. 27-32.
ISBN 1902956761