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Security framework for the semiconductor supply chain environment

Security framework for the semiconductor supply chain environment

Esfahani, Alireza, Mantas, Georgios, Barcelos, Mariana, Saghezchi, Firooz B., Sucasas, Victor, Bastos, Joaquim and Rodriguez, Jonathan (2018) Security framework for the semiconductor supply chain environment. In: Broadband Communications, Networks, and Systems. Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering book series (LNICST) (263). Springer, Cham, Switzerland, pp. 159-168. ISBN 978-303005194-5 ISSN 1867-8211 (doi:https://doi.org/10.1007/978-3-030-05195-2_16)

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Abstract

This paper proposes a security framework for secure data communications across the partners in the Semiconductor Supply Chain Environment. The security mechanisms of the proposed framework will be based on the SSL/TLS and OAuth 2.0 protocols, which are two standard security protocols. However, both protocols are vulnerable to a number of attacks, and thus more sophisticated security mechanisms based on these protocols should be designed and implemented in order to address the specific security challenges of the Semiconductor Supply Chain in a more effective and efficient manner.

Item Type: Conference Proceedings
Title of Proceedings: Broadband Communications, Networks, and Systems
Additional Information: Proceedings of the 9th International EAI Conference, Broadnets 2018, Faro, Portugal, September 19–20, 2018.
Uncontrolled Keywords: Industry 4.0, Semiconductor Supply Chain, Network Secure Com-munications, SSL/TLS, OAuth2
Subjects: T Technology > TA Engineering (General). Civil engineering (General)
Faculty / Department / Research Group: Faculty of Engineering & Science
Faculty of Engineering & Science > Department of Applied Engineering & Management
Last Modified: 14 Apr 2020 22:20
Selected for GREAT 2016: None
Selected for GREAT 2017: None
Selected for GREAT 2018: None
Selected for GREAT 2019: None
Selected for REF2021: None
URI: http://gala.gre.ac.uk/id/eprint/27702

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