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Number of items: 2.

C

Costello, S., Strusevich, N., Flynn, D., Kay, R.W., Patel, M.K., Bailey, C., Price, D., Bennet, M., Jones, A.C. and Desmulliez, M.P.Y. (2013) Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. Microsystem Technologies, 19 (6). pp. 783-790. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-013-1746-7)

K

Kaufmann, Jens Georg, Desmulliez, Marc P.Y., Tian, Yingtao, Price, Dennis, Hughes, Mike, Strusevitch, Nadia, Bailey, Chris, Liu, Changqing and Hutt, David (2009) Megasonic agitation for enhanced electrodeposition of copper. Microsystem Technologies, 15 (8). pp. 1245-1254. ISSN 0946-7076 (Print), 1432-1858 (Online) (doi:10.1007/s00542-009-0886-2)

This list was generated on Fri Jun 22 12:18:25 2018 BST.