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Group by: Creators | Item Type | Uncontrolled Keywords | No Grouping
63Sn37Pb solder joints Au/Ni metallization ball grid array (BGA) Cu trace current stressing induction melting interfacial reaction reactive materials solder joints titanium aluminide titanium processing
Number of items: 3.

63Sn37Pb solder joints

Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1007/s10853-007-1836-y)

Au/Ni metallization

Zhong, W.H., Chan, Y.C., Wu, B.Y., Alam, M.O. and Guan, J.F. (2007) Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization. Journal of Materials Science, 42 (13). pp. 5239-5247. ISSN 0022-2461 (doi:10.1007/s10853)

ball grid array (BGA)

Zhong, W.H., Chan, Y.C., Wu, B.Y., Alam, M.O. and Guan, J.F. (2007) Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization. Journal of Materials Science, 42 (13). pp. 5239-5247. ISSN 0022-2461 (doi:10.1007/s10853)

Cu trace

Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1007/s10853-007-1836-y)

current stressing

Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1007/s10853-007-1836-y)

induction melting

Bojarevics, V. and Pericleous, K. (2004) Modelling induction skull melting design modifications. Journal of Materials Science, 39 (24). pp. 7245-7251. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1023/B:JMSC.0000048738.06025.9b)

interfacial reaction

Wu, B.Y., Chan, Y.C, Zhong, H.W. and Alam, M.O. (2007) Effect of current stressing on the reliability of 63Sn37Pb solder joints. Journal of Materials Science, 42 (17). pp. 7415-7422. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1007/s10853-007-1836-y)

reactive materials

Bojarevics, V. and Pericleous, K. (2004) Modelling induction skull melting design modifications. Journal of Materials Science, 39 (24). pp. 7245-7251. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1023/B:JMSC.0000048738.06025.9b)

solder joints

Zhong, W.H., Chan, Y.C., Wu, B.Y., Alam, M.O. and Guan, J.F. (2007) Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization. Journal of Materials Science, 42 (13). pp. 5239-5247. ISSN 0022-2461 (doi:10.1007/s10853)

titanium aluminide

Bojarevics, V. and Pericleous, K. (2004) Modelling induction skull melting design modifications. Journal of Materials Science, 39 (24). pp. 7245-7251. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1023/B:JMSC.0000048738.06025.9b)

titanium processing

Bojarevics, V. and Pericleous, K. (2004) Modelling induction skull melting design modifications. Journal of Materials Science, 39 (24). pp. 7245-7251. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:10.1023/B:JMSC.0000048738.06025.9b)

This list was generated on Thu Jun 20 03:00:26 2013 BST.