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Number of items: 2.

L

Lu, Hua, Bailey, C. and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:10.1115/1.1286122)

R

Rajaguru, Pushparajah, Stoyanov, Stoyan, Lu, Hua and Bailey, Christopher (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:10.1115/1.4024056)

This list was generated on Fri Apr 20 23:07:41 2018 BST.