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Lu, Hua, Bailey, C. and Cross, M. (2000) Reliability analysis of flip chip designs via computer simulation. Journal of Electronic Packaging, 122 (3). pp. 214-219. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:10.1115/1.1286122)


Rajaguru, Pushparajah ORCID: 0000-0002-6041-0517, Stoyanov, Stoyan ORCID: 0000-0001-6091-1226, Lu, Hua and Bailey, Christopher (2013) Application of Kriging and radial basis function for reliability optimization in power modules. Journal of Electronic Packaging, 135 (2):021009. ISSN 1528-9044 (Print), 1043-7398 (Online) (doi:10.1115/1.4024056)

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