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Number of items: 25.

aging

Rizvi, M.J., Bailey, Christopher, Chan, Y.C., Islam, M. and Lu, Hua (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.071)

Rizvi, M.J., Chan, Y.C., Bailey, Christopher, Lu, Hua and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:10.1016/j.jallcom.2005.06.050)

contact angle

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.048)

flux

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.048)

growth rate

Rizvi, M.J., Chan, Y.C., Bailey, Christopher, Lu, Hua and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:10.1016/j.jallcom.2005.06.050)

High pressure

Szilágyi, Petra Á., Hunter, Steven, Morrison, Carole A., Tang, Chiu C. and Pulham, Colin R. (2017) Pressure-induced structural changes in methylamine borane and dimethylamine borane. Journal of Alloys and Compounds, 722. pp. 953-961. ISSN 0925-8388 (doi:10.1016/j.jallcom.2017.06.174)

Hydrogen storage

Szilágyi, Petra Á., Hunter, Steven, Morrison, Carole A., Tang, Chiu C. and Pulham, Colin R. (2017) Pressure-induced structural changes in methylamine borane and dimethylamine borane. Journal of Alloys and Compounds, 722. pp. 953-961. ISSN 0925-8388 (doi:10.1016/j.jallcom.2017.06.174)

interfacial reactions

Rizvi, M.J., Chan, Y.C., Bailey, Christopher, Lu, Hua and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:10.1016/j.jallcom.2005.06.050)

intermetallic compound layer

Rizvi, M.J., Bailey, Christopher, Chan, Y.C., Islam, M. and Lu, Hua (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.071)

intermetallic compounds

Rizvi, M.J., Chan, Y.C., Bailey, Christopher, Lu, Hua and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:10.1016/j.jallcom.2005.06.050)

metal–hydrogen systems

Lu, Hua, Zhang, Xiaohong and Titman, J.M. (1997) Measuring distributions of jump rates in disordered metal–hydrogen systems by nuclear magnetic relaxation. Journal of Alloys and Compounds, 253. pp. 425-427. ISSN 0925-8388 (doi:10.1016/S0925-8388(96)03083-6)

modeling

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.048)

Monte Carlo calculations

Lu, Hua, Zhang, Xiaohong and Titman, J.M. (1997) Measuring distributions of jump rates in disordered metal–hydrogen systems by nuclear magnetic relaxation. Journal of Alloys and Compounds, 253. pp. 425-427. ISSN 0925-8388 (doi:10.1016/S0925-8388(96)03083-6)

nuclear magnetic relaxation

Lu, Hua, Zhang, Xiaohong and Titman, J.M. (1997) Measuring distributions of jump rates in disordered metal–hydrogen systems by nuclear magnetic relaxation. Journal of Alloys and Compounds, 253. pp. 425-427. ISSN 0925-8388 (doi:10.1016/S0925-8388(96)03083-6)

Phase transition

Szilágyi, Petra Á., Hunter, Steven, Morrison, Carole A., Tang, Chiu C. and Pulham, Colin R. (2017) Pressure-induced structural changes in methylamine borane and dimethylamine borane. Journal of Alloys and Compounds, 722. pp. 953-961. ISSN 0925-8388 (doi:10.1016/j.jallcom.2017.06.174)

rare earth intermetallic compounds

Wang, Yi, Shen, J., Chen, N.X. and Wang, J.L. (2001) Theoretical investigation on site preference of foreign atoms in rare-earth intermetallics. Journal of Alloys and Compounds, 319 (1-2). pp. 62-73. ISSN 0925-8388 (doi:10.1016/S0925-8388(01)00909-4)

site occupancy

Wang, Yi, Shen, J., Chen, N.X. and Wang, J.L. (2001) Theoretical investigation on site preference of foreign atoms in rare-earth intermetallics. Journal of Alloys and Compounds, 319 (1-2). pp. 62-73. ISSN 0925-8388 (doi:10.1016/S0925-8388(01)00909-4)

solder

Rizvi, M.J., Bailey, Christopher, Chan, Y.C., Islam, M. and Lu, Hua (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.071)

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.048)

soldering

Rizvi, M.J., Chan, Y.C., Bailey, Christopher, Lu, Hua and Islam, M.N. (2006) Effect of adding 1 wt% Bi into the Sn–2.8Ag–0.5Cu solder alloy on the intermetallic formations with Cu-substrate during soldering and isothermal aging. Journal of Alloys and Compounds, 407 (1-2). pp. 208-214. ISSN 0925-8388 (doi:10.1016/j.jallcom.2005.06.050)

Synchrotron X-ray powder diffraction

Szilágyi, Petra Á., Hunter, Steven, Morrison, Carole A., Tang, Chiu C. and Pulham, Colin R. (2017) Pressure-induced structural changes in methylamine borane and dimethylamine borane. Journal of Alloys and Compounds, 722. pp. 953-961. ISSN 0925-8388 (doi:10.1016/j.jallcom.2017.06.174)

theory and modeling

Wang, Yi, Shen, J., Chen, N.X. and Wang, J.L. (2001) Theoretical investigation on site preference of foreign atoms in rare-earth intermetallics. Journal of Alloys and Compounds, 319 (1-2). pp. 62-73. ISSN 0925-8388 (doi:10.1016/S0925-8388(01)00909-4)

wetting

Rizvi, M.J., Bailey, Christopher, Chan, Y.C., Islam, M. and Lu, Hua (2007) Effect of adding 0.3wt% Ni into the Sn-0.7wt% Cu solder - Part II: Growth of intermetallic layer with Cu during wetting and aging. Journal of Alloys and Compounds, 438 (1-2). pp. 122-128. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.071)

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.048)

wetting force

Rizvi, M.J., Bailey, Christopher, Chan, Y.C. and Lu, Hua (2007) Effect of adding 0.3 wt% Ni into the Sn–0.7 wt%Cu solder: part I: wetting behavior on Cu and Ni substrates. Journal of Alloys and Compounds, 438 (1-2). pp. 116-121. ISSN 0925-8388 (doi:10.1016/j.jallcom.2006.08.048)

This list was generated on Mon Apr 23 08:53:21 2018 BST.