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Number of items: 6.

flux

Mallik, S., Ekere, N.N. and Bhatti, R. (2010) Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications. Journal of ASTM International, 7 (9). ISSN 1546-962X (doi:10.1520/JAI103043)

lead-free

Mallik, S., Ekere, N.N. and Bhatti, R. (2010) Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications. Journal of ASTM International, 7 (9). ISSN 1546-962X (doi:10.1520/JAI103043)

rheology

Mallik, S., Ekere, N.N. and Bhatti, R. (2010) Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications. Journal of ASTM International, 7 (9). ISSN 1546-962X (doi:10.1520/JAI103043)

solder pastes

Mallik, S., Ekere, N.N. and Bhatti, R. (2010) Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications. Journal of ASTM International, 7 (9). ISSN 1546-962X (doi:10.1520/JAI103043)

stretched exponential model

Mallik, S., Ekere, N.N. and Bhatti, R. (2010) Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications. Journal of ASTM International, 7 (9). ISSN 1546-962X (doi:10.1520/JAI103043)

time-dependent behaviors

Mallik, S., Ekere, N.N. and Bhatti, R. (2010) Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications. Journal of ASTM International, 7 (9). ISSN 1546-962X (doi:10.1520/JAI103043)

This list was generated on Tue May 22 17:01:31 2018 BST.