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Mallik, S., Ekere, N.N. and Bhatti, R. (2010) Empirical modeling of the time-dependent structural build-up of lead-free solder pastes used in the electronics assembly applications. Journal of ASTM International, 7 (9). ISSN 1546-962X (doi:10.1520/JAI103043)

This list was generated on Wed Jun 20 15:56:53 2018 BST.