Skip navigation

Browse by Journal Title

Browse by Journal Title

Up a level
Export as [feed] RSS
Jump to: A
Number of items: 1.


Alam, M.O., Lu, Hua, Bailey, Chris and Chan, Y.C (2009) Finite-element simulation of stress intensity factors in solder joint intermetallic compounds. IEEE Transactions on Device and Materials Reliability, 9 (1). pp. 40-48. ISSN 1530-4388 (doi:10.1109/TDMR.2008.2010595)

This list was generated on Wed Mar 21 18:50:21 2018 GMT.