Skip navigation

Browse by Journal Title

Browse by Journal Title

Up a level
Export as [feed] RSS
Group by: Creators | Item Type | Uncontrolled Keywords | No Grouping
Number of items: 11.

digital simulation

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

electronic engineering computing

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

heat transfer

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

melting

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

multiphysics modeling

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

printed circuit manufacture

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

solder

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

soldering

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

solidification

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

surface tension

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

thermal stress

Bailey, Christopher ORCID: 0000-0002-9438-3879 , Wheeler, Daniel and Cross, Mark (1999) An integrated modeling approach to solder joint formation. IEEE Transactions on Components and Packaging Technology, 22 (4). pp. 497-502. ISSN 1521-3331 (doi:https://doi.org/10.1109/6144.814964)

This list was generated on Thu Mar 28 23:35:18 2024 UTC.