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Items where Author is "Zhu, Xiaoxin"

Items where Author is "Zhu, Xiaoxin"

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acoustics atomic diffusions atomic vacancies coatings current loadings dispersion electromigration EM simulations EM-aware design interconnect microelectronics reliability morphology multi-physics physical modeling reliability simulation surface morphology surface topography surface treatment void formation
Number of items: 20.

acoustics

Xu, Sha, Chan, Yan Cheong, Zhu, Xiaoxin, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) Effective method to disperse and incorporate carbon nanotubes in electroless Ni-P deposits. In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Proceedings. Curran Associates, Stoughton, WI, USA, pp. 1342-1347. ISBN 9781479924080 (doi:https://doi.org/10.1109/ECTC.2014.6897466)

atomic diffusions

Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: 0000-0002-4392-6562 , Mannan, S.H., Chan, Y.C. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Multi-physics computer simulation of the electromigration phenomenon. In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE Computer Society, Piscataway, USA, pp. 448-452. ISBN 9781457717703 (Print), 9781457717680 (Online) (doi:https://doi.org/10.1109/ICEPT.2011.6066874)

atomic vacancies

Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: 0000-0002-4392-6562 , Mannan, S.H., Chan, Y.C. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Multi-physics computer simulation of the electromigration phenomenon. In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE Computer Society, Piscataway, USA, pp. 448-452. ISBN 9781457717703 (Print), 9781457717680 (Online) (doi:https://doi.org/10.1109/ICEPT.2011.6066874)

coatings

Xu, Sha, Chan, Yan Cheong, Zhu, Xiaoxin, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) Effective method to disperse and incorporate carbon nanotubes in electroless Ni-P deposits. In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Proceedings. Curran Associates, Stoughton, WI, USA, pp. 1342-1347. ISBN 9781479924080 (doi:https://doi.org/10.1109/ECTC.2014.6897466)

current loadings

Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: 0000-0002-4392-6562 , Mannan, S.H., Chan, Y.C. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Multi-physics computer simulation of the electromigration phenomenon. In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE Computer Society, Piscataway, USA, pp. 448-452. ISBN 9781457717703 (Print), 9781457717680 (Online) (doi:https://doi.org/10.1109/ICEPT.2011.6066874)

dispersion

Xu, Sha, Chan, Yan Cheong, Zhu, Xiaoxin, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) Effective method to disperse and incorporate carbon nanotubes in electroless Ni-P deposits. In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Proceedings. Curran Associates, Stoughton, WI, USA, pp. 1342-1347. ISBN 9781479924080 (doi:https://doi.org/10.1109/ECTC.2014.6897466)

electromigration

Zhu, Xiaoxin (2014) Computer simulation of electromigration in microelectronics interconnect. PhD thesis, University of Greenwich.

EM simulations

Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: 0000-0002-4392-6562 , Mannan, S.H., Chan, Y.C. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Multi-physics computer simulation of the electromigration phenomenon. In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE Computer Society, Piscataway, USA, pp. 448-452. ISBN 9781457717703 (Print), 9781457717680 (Online) (doi:https://doi.org/10.1109/ICEPT.2011.6066874)

EM-aware design

Zhu, Xiaoxin (2014) Computer simulation of electromigration in microelectronics interconnect. PhD thesis, University of Greenwich.

interconnect

Zhu, Xiaoxin (2014) Computer simulation of electromigration in microelectronics interconnect. PhD thesis, University of Greenwich.

microelectronics reliability

Zhu, Xiaoxin (2014) Computer simulation of electromigration in microelectronics interconnect. PhD thesis, University of Greenwich.

morphology

Xu, Sha, Chan, Yan Cheong, Zhu, Xiaoxin, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) Effective method to disperse and incorporate carbon nanotubes in electroless Ni-P deposits. In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Proceedings. Curran Associates, Stoughton, WI, USA, pp. 1342-1347. ISBN 9781479924080 (doi:https://doi.org/10.1109/ECTC.2014.6897466)

multi-physics

Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: 0000-0002-4392-6562 , Mannan, S.H., Chan, Y.C. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Multi-physics computer simulation of the electromigration phenomenon. In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE Computer Society, Piscataway, USA, pp. 448-452. ISBN 9781457717703 (Print), 9781457717680 (Online) (doi:https://doi.org/10.1109/ICEPT.2011.6066874)

physical modeling

Zhu, Xiaoxin (2014) Computer simulation of electromigration in microelectronics interconnect. PhD thesis, University of Greenwich.

reliability

Zhu, Xiaoxin (2014) Computer simulation of electromigration in microelectronics interconnect. PhD thesis, University of Greenwich.

simulation

Zhu, Xiaoxin (2014) Computer simulation of electromigration in microelectronics interconnect. PhD thesis, University of Greenwich.

surface morphology

Xu, Sha, Chan, Yan Cheong, Zhu, Xiaoxin, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) Effective method to disperse and incorporate carbon nanotubes in electroless Ni-P deposits. In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Proceedings. Curran Associates, Stoughton, WI, USA, pp. 1342-1347. ISBN 9781479924080 (doi:https://doi.org/10.1109/ECTC.2014.6897466)

surface topography

Xu, Sha, Chan, Yan Cheong, Zhu, Xiaoxin, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) Effective method to disperse and incorporate carbon nanotubes in electroless Ni-P deposits. In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Proceedings. Curran Associates, Stoughton, WI, USA, pp. 1342-1347. ISBN 9781479924080 (doi:https://doi.org/10.1109/ECTC.2014.6897466)

surface treatment

Xu, Sha, Chan, Yan Cheong, Zhu, Xiaoxin, Lu, Hua ORCID: 0000-0002-4392-6562 and Bailey, Chris ORCID: 0000-0002-9438-3879 (2014) Effective method to disperse and incorporate carbon nanotubes in electroless Ni-P deposits. In: 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) Proceedings. Curran Associates, Stoughton, WI, USA, pp. 1342-1347. ISBN 9781479924080 (doi:https://doi.org/10.1109/ECTC.2014.6897466)

void formation

Zhu, Xiaoxin, Kotadia, H., Xu, Sha, Lu, Hua ORCID: 0000-0002-4392-6562 , Mannan, S.H., Chan, Y.C. and Bailey, C. ORCID: 0000-0002-9438-3879 (2011) Multi-physics computer simulation of the electromigration phenomenon. In: ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging. IEEE Computer Society, Piscataway, USA, pp. 448-452. ISBN 9781457717703 (Print), 9781457717680 (Online) (doi:https://doi.org/10.1109/ICEPT.2011.6066874)

This list was generated on Fri Apr 19 13:56:17 2024 UTC.