Skip navigation

Items where Author is "Zhong, W.H."

Items where Author is "Zhong, W.H."

Up a level
Export as [feed] RSS
Group by: Item Type | Uncontrolled Keywords | No Grouping
Number of items: 3.

Au/Ni metallization

Zhong, W.H., Chan, Y.C., Wu, B.Y., Alam, M.O. and Guan, J.F. (2007) Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization. Journal of Materials Science, 42 (13). pp. 5239-5247. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:https://doi.org/10.1007/s10853-006-1234-x)

ball grid array (BGA)

Zhong, W.H., Chan, Y.C., Wu, B.Y., Alam, M.O. and Guan, J.F. (2007) Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization. Journal of Materials Science, 42 (13). pp. 5239-5247. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:https://doi.org/10.1007/s10853-006-1234-x)

solder joints

Zhong, W.H., Chan, Y.C., Wu, B.Y., Alam, M.O. and Guan, J.F. (2007) Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization. Journal of Materials Science, 42 (13). pp. 5239-5247. ISSN 0022-2461 (Print), 1573-4803 (Online) (doi:https://doi.org/10.1007/s10853-006-1234-x)

This list was generated on Thu Mar 28 19:38:05 2024 UTC.